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Adhesives for assembly procedures for products of radioelectronic industry

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Abstract

A list of adhesive materials, sealants, and potting compounds used at the enterprise is given. The basic properties of these materials are discussed, and particular process procedures in which they are employed are described.

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Authors and Affiliations

  1. Scientific and Production Center SPURT, State Unitary Enterprise, Pervyi Zapadnyi proezd 4, Zelenograd, Moscow, 124460, Russia

    T. A. Chertova

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  1. T. A. Chertova
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Correspondence to T. A. Chertova.

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Original Russian Text © T.A. Chertova, 2010, published in Klei. Germetiki. Tekhnologii, 2010, No. 4, pp. 22–25.

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Chertova, T.A. Adhesives for assembly procedures for products of radioelectronic industry. Polym. Sci. Ser. D 3, 252–254 (2010). https://doi.org/10.1134/S199542121004009X

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  • DOI: https://doi.org/10.1134/S199542121004009X

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