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Use of organosilicon compounds as modifiers of epoxy compositions

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Abstract

Organosilicon compounds used to improve the strength and adhesion properties, as well as the thermal stability, of epoxy compositions are reviewed. Properties of composition on the basis of bisphenol A-based ED-20 resin cured with a KrOOT-1 silicon-containing amine are described.

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Authors and Affiliations

  1. Kazan State Technological University, ul. Karla Marksa 68, Kazan, Tatarstan, 420043, Russia

    A. A. Efremov, A. I. Zagidullin, M. V. Kolpakova, R. M. Garipov & O. V. Stoyanov

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  1. A. A. Efremov
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  2. A. I. Zagidullin
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  3. M. V. Kolpakova
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  4. R. M. Garipov
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  5. O. V. Stoyanov
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Correspondence to O. V. Stoyanov.

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Original Russian Text © A.A. Efremov, A.I. Zagidullin, M.V. Kolpakova, R.M. Garipov, O.V. Stoyanov, 2008, published in Klei. Germetiki. Tekhnologii, 2008, No. 4, pp. 12–18.

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Efremov, A.A., Zagidullin, A.I., Kolpakova, M.V. et al. Use of organosilicon compounds as modifiers of epoxy compositions. Polym. Sci. Ser. D 1, 244–248 (2008). https://doi.org/10.1134/S1995421208040060

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  • DOI: https://doi.org/10.1134/S1995421208040060

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