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Use of thermal analysis techniques for studying a hot-melt adhesive

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Abstract

Examples of the use of thermal analysis instruments and techniques for the investigation and formulation of hot-melt adhesives are reported, and the feasibility of an immediate study of the effect of various components and process additives on the thermal, physical, and mechanical characteristics of adhesive joints is discussed.

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References

  1. A. P. Petrova, Adhesive Materials Handbook, Ed. by E. N. Kablov and S. V. Reznichenko (K i R, Moscow, 2002) [in Russian].

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  2. V. A. Bershtein and V. M. Egorov, Differential Scanning Calorimetry in Physical Chemistry of Polymers (Khimiya, Leningrad, 1990) [in Russian].

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  3. V. M. Aleksashin and N. V. Antyufeeva, Klei Germet. Tekhnol., No. 12, 28 (2005).

  4. E. R. Mukhamedzyanova, Extended Abstract of Candidate’s Dissertation in Technical Sciences (Kazan, 2002).

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Authors and Affiliations

  1. All-Russia Institute of Aircraft Materials, ul. Radio 17, Moscow, 105005, Russia

    I. I. Khairullin, V. M. Aleksashin & A. P. Petrova

Authors
  1. I. I. Khairullin
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  2. V. M. Aleksashin
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  3. A. P. Petrova
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Additional information

Original Russian Text © I.I. Khairullin, V.M. Aleksashin, A.P. Petrova, 2006, published in Klei. Germetiki, Tekhnologii, 2006, No. 5, pp. 21–26.

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Khairullin, I.I., Aleksashin, V.M. & Petrova, A.P. Use of thermal analysis techniques for studying a hot-melt adhesive. Polym. Sci. Ser. C 49, 84–88 (2007). https://doi.org/10.1134/S1811238207010195

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  • DOI: https://doi.org/10.1134/S1811238207010195

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