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The influence of thermal processing on the structure and composition of the surface of copper bedding

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Abstract

The surface of a copper plate for compounding is studied before and after its oxidation. The heat treatment in the air in the temperature range of 100–200°C for 10–40 min enables the formation of a thin solid layer of copper oxide, CuO, eliminates the porosity of the surface of the copper plate, modifies its micro-structure, and substantially increases the surface maturity, and thus increases the adhesion in the Cu-polymer system. This phenomenon was proved by Auger spectroscopy (ASS), scanning electron microscopy (SEM) and atomic forced microscopy (AFM).

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Authors and Affiliations

  1. St. Petersburg Electrotechnical University LETI, ul. Professora Popova 5, St. Petersburg, 197376, Russia

    V. P. Afanas’ev, A. A. Petrov & L. G. Alekseeva

Authors
  1. V. P. Afanas’ev
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  2. A. A. Petrov
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  3. L. G. Alekseeva
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Correspondence to V. P. Afanas’ev.

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Original Russian Text © V.P. Afanas’ev, A.A. Petrov, L.G. Alekseeva, 2014, published in Fizika i Khimiya Stekla.

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Afanas’ev, V.P., Petrov, A.A. & Alekseeva, L.G. The influence of thermal processing on the structure and composition of the surface of copper bedding. Glass Phys Chem 40, 129–131 (2014). https://doi.org/10.1134/S1087659614010027

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  • DOI: https://doi.org/10.1134/S1087659614010027

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