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Electrochemical deposition of copper on steel from a solution of diacido-1,3-propylenediamine-N,N′-diacetato-N,N′-dipropionate cuprate(II)

  • Applied Electrochemistry and Corrosion Protection of Metals
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Abstract

The possibility of obtaining smooth homogeneous copper coatings with good adhesion and homogeneous copper coatings with poor adhesion by electrochemical deposition of copper on steel from a solution of nontoxic copper(II) complex with the ligands, 1,3-propylenediamine-N,N′-diacetato-N,N′-di-3-propionic acid, was analyzed. For both types of coatings, the optimum composition of the solution and the optimum deposition conditions were determined.

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Authors and Affiliations

  1. University of Kragujevac, Čačak, Serbia

    M. Spasoević, M. Cvijović, L. Rybić-Zelenović & G. Aćamović-Joković

Authors
  1. M. Spasoević
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  2. M. Cvijović
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  3. L. Rybić-Zelenović
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  4. G. Aćamović-Joković
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Original Russian Text © M. Spasoević, M. Cvijović, L. Rybić-Zelenović, G. Aćamović-Joković, 2007, published in Zhurnal Prikladnoi Khimii, 2007, Vol. 80, No. 4, pp. 579–583.

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Spasoević, M., Cvijović, M., Rybić-Zelenović, L. et al. Electrochemical deposition of copper on steel from a solution of diacido-1,3-propylenediamine-N,N′-diacetato-N,N′-dipropionate cuprate(II). Russ J Appl Chem 80, 566–570 (2007). https://doi.org/10.1134/S107042720704009X

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  • DOI: https://doi.org/10.1134/S107042720704009X

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