Features of CoSi2 phase formation by two-stage rapid thermal annealing of Ti/Co/Ti/Si(100) structures
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A method of cobalt disilicide (CoSi2) layer formation proceeding from a Ti(8 nm)/Co(10 nm)/Ti(5 nm)/Si(100) (substrate) structure prepared by magnetron sputtering is described. The initial structure was subjected to two-stage rapid thermal annealing (RTA) in nitrogen, and the samples after each stage were studied by the time-of-flight secondary-ion mass spectrometry, Auger electron spectroscopy, scanning electron microscopy, and energy-dispersive X-ray spectroscopy. The RTA-1 stage (550°C, 45 s) resulted in the formation of a sacrificial surface layer of TiN x O y , which gettered residual impurities (O, C, N) from inner interfaces of the initial structure. After the chemical removal of this TiN x O y layer, the enrichment with cobalt at the RTA-2 stage (830°C, 25 s) led to the formation of a low-resistance CoSi2 phase.
KeywordsTechnical Physic Letter Rapid Thermal Annealing Depth Concentration Profile Temperature Rapid Thermal Annealing CoSi2 Phase
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