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Physical and Technological Characteristic Features of the Process of Installation of Dies onto a Temporary Foundation in Internal Wiring Technology

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Abstract

The physical and technological characteristic features of the installation of dies onto a temporary foundation in the internal wiring technology are studied. The justified selection of the material for the fixation of silicon dies active side down onto a temporary foundation from various solutions of polyamic acids (PAAs) is performed. The experimental dependence of the adhesion strength of silicon dies on the lifetime of the solutions of PAAs is found. The possible defects formed upon the imidization of PAAs in the process of creation of highly integrated microassemblies, multidie modules, and electronic modules of the “system in package” level are shown.

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Funding

The source of funding for this work was agreement no. 9/1251/2019 on the provision of a grant for state support from the centers of National Technological Initiative based on educational higher education institutions and scientific establishments.

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Authors and Affiliations

  1. National Research University “MIET”, 124498, Moscow, Russia

    D. V. Vertyanov, N. E. Korobova & A. V. Pogudkin

  2. Bekturov Institute of Chemical Sciences, 050000, Almaty, Kazakhstan

    V. D. Kravtsova

Authors
  1. D. V. Vertyanov
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  2. N. E. Korobova
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  3. A. V. Pogudkin
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  4. V. D. Kravtsova
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Corresponding author

Correspondence to N. E. Korobova.

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The authors declare that they have no conflicts of interest.

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Translated by E. Boltukhina

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Vertyanov, D.V., Korobova, N.E., Pogudkin, A.V. et al. Physical and Technological Characteristic Features of the Process of Installation of Dies onto a Temporary Foundation in Internal Wiring Technology. Tech. Phys. 65, 1677–1684 (2020). https://doi.org/10.1134/S1063784220100230

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  • DOI: https://doi.org/10.1134/S1063784220100230

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