Abstract
The structure and microhardness of textured ribbon substrates made of binary copper-based alloys and annealed in the temperature interval 400–600°C is investigated. The optimal temperature of additional annealing at which the strength of Cu–Fe and Cu–Cr alloys reaches a maximum is determined. From experimental data, recommendations on the optimal deposition temperature of epitaxial buffer layers and superconducting films can be developed.
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Original Russian Text © Yu.V. Khlebnikova, D.P. Rodionov, I.V. Gervas’eva, L.Yu. Egorova, T.R. Suaridze, 2016, published in Zhurnal Tekhnicheskoi Fiziki, 2016, Vol. 61, No. 2, pp. 149–152.
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Khlebnikova, Y.V., Rodionov, D.P., Gervas’eva, I.V. et al. On additional aging-induced hardening of textured ribbon substrates prepared from binary copper-based alloys. Tech. Phys. 61, 306–309 (2016). https://doi.org/10.1134/S1063784216020146
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DOI: https://doi.org/10.1134/S1063784216020146