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Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films

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Abstract

The formation of the Cu6Sn5 intermetallic in Sn(55nm)/Cu(30nm) thin-film bilayers has been studied upon heating the film sample from room temperature to 300°C directly in a column of a transmission electron microscope in the electron diffraction mode with recording electron diffraction patterns. The thin films synthesized by the solid-state reaction have been found to be single-phase and consist of the η-Cu6Sn5 hexagonal phase (95‒260°C). It has been suggested basing on the effective interdiffusion coefficient (5 × 10‒16 m2/s) estimated in the course of the reaction that the main mechanism of the formation of the Cu6Sn5 thin films is diffusion along grain boundaries and dislocations.

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ACKNOWLEDGMENTS

The authors thank V.S. Zhigalov for preparing the samples for investigations.

Funding

The study was supported by the Russian Foundation for Basic Research, project no. 19-43-240003. The electron microscopy study was carried out at the Krasnoyarsk Regional Center for Collective Use of the Krasnoyarsk Scientific Center, Siberian Branch of the Russian Academy of Sciences and at the Laboratory of Electron Microscopy of the Center for Collective Use of the Siberian Federal University within the state assignment of the Ministry of Science and Higher Education of the Russian Federation, research theme code FSRZ-2020-0011.

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Authors and Affiliations

  1. Kirensky Institute of Physics, Krasnoyarsk Scientific Center, Siberian Branch, Russian Academy of Sciences, 660036, Krasnoyarsk, Russia

    L. E. Bykova, S. M. Zharkov, V. G. Myagkov, Yu. Yu. Balashov & G. S. Patrin

  2. Siberian Federal University, 660041, Krasnoyarsk, Russia

    S. M. Zharkov & G. S. Patrin

Authors
  1. L. E. Bykova
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  2. S. M. Zharkov
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  3. V. G. Myagkov
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  4. Yu. Yu. Balashov
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  5. G. S. Patrin
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Corresponding author

Correspondence to L. E. Bykova.

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The authors declare that they have no conflicts of interest.

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Translated by E. Bondareva

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Bykova, L.E., Zharkov, S.M., Myagkov, V.G. et al. Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films. Phys. Solid State 64, 33–37 (2022). https://doi.org/10.1134/S1063783422010048

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  • DOI: https://doi.org/10.1134/S1063783422010048

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