Abstract
Trilayer epitaxial heterostructures in which a 700-nm-thick SrTiO3 interlayer is integrated with two SrRuO3 electrodes have been grown by laser ablation. In the top electrode, twenty contact pads (S ≈ 0.1 mm2) have been formed using photolithography and ion etching. The bottom SrRuO3 electrode grown on a MgO(001) substrate is common for all film capacitors on the chip. As the temperature decreases in the range of 300-50 K, the capacitance C of the capacitors increases by a factor more than two due to an increase in the permittivity ɛ of the interlayer. At T = 4.2 K, as the bias voltage of ±2.5 V is applied to the oxide electrodes, the capacitance C decreases by ∼40%. In the temperature range of 100–300 K, the ratio ɛ0/ɛ increases almost linearly with increasing temperature (ɛ0 is the permittivity in vacuum). At T > 250 K, the dielectric loss tangent of the SrTiO3 interlayer increases exponentially with increasing temperature and substantially depends on the bias voltage applied to the oxide electrodes.
Similar content being viewed by others
References
R. Dittmann, R. Plonka, E. Vasco, N. A. Pertsev, J. Q. He, C. L. Jia, S. Hoffmann-Eifert, and R. Waser, Appl. Phys. Lett. 83, 5011 (2003).
A. Sharma, Z.-G. Ban, S. P. Alpay, and J. V. Mantese, Appl. Phys. Lett. 85, 985 (2004).
Yu. A. Boikov, E. Olsson, and T. Claeson, Phys. Rev. B: Condens. Matter 74, 024114–1 (2006).
Yu. A. Boikov, Z. G. Ivanov, A. N. Kiselev, E. Olsson, and T. Claeson, J. Appl. Phys. 78, 4591 (1995).
P. A. Cox, R. G. Egdell, J. B. Goodenough, A. Hamnett, and C. C. Naish, J. Phys. C: Solid State Phys. 16, 6221 (1983).
X. Fang and T. Kobayashi, J. Appl. Phys. 90, 162 (2001).
A. G. Schrott, J. A. Misewich, V. Nagarajan, and R. Ramesh, Appl. Phys. Lett. 82, 4770 (2003).
M. Julia, Phillips. J. Appl. Phys. 79, 1829 (1996).
J. C. Jiang, W. Tian, X. Pan, Q. Gan, and C. B. Eom, Mater. Sci. Eng., B 56, 152 (1998).
R. B. Wyckoff, Crystal Structures, 2nd ed. (Interscience, New York, 1964), Vol. 2, p. 394.
V. Srikant, E. J. Tarsa, D. R. Clarke, and J. S. Speck, J. Appl. Phys. 77, 1517 (1995).
Luke S.-J. Peng, X. X. Xi, and Brian H. Moeckly, Appl. Phys. Lett. 83, 4592 (2003).
Yu. A. Boikov and T. Claeson, Physica C (Amsterdam) 336(3–4), 300 (2000).
E. D. Specht, R. E. Clausing, and L. Heatherly, J. Mater. Res. 5, 2351 (1990).
A. D. Hilton and B. W. Ricketts, J. Phys. D: Appl. Phys. 29, 1321 (1996).
G. Simmons, Appl. Phys. Lett. 6, 54 (1965).
Yu. A. Boikov and V. A. Danilov, Tech. Phys. Lett. 30(5), 361 (2004).
Yu. A. Boikov and T. Claeson, Appl. Phys. Lett. 80, 4603 (2002).
Yu. A. Boikov, R. Gunnarsson, and T. Claeson, J. Appl. Phys. 96, 435 (2004).
R. Viana, P. Lunkenheimer, J. Hemberger, R. Böhmer, and A. Loide, Phys. Rev. B: Condens. Matter 50, 601 (1994).
J. R. Yeargan and H. L. Taylor, J. Appl. Phys. 39, 5600 (1968).
P. Dorenbos, H. W. den Hartog, R. Kruizinga, and S. Vrind, Phys. Rev. B: Condens. Matter 35, 5774 (1987).
O. N. Tufte and P. W. Chapman, Phys. Rev. 155, 796 (1967).
Author information
Authors and Affiliations
Corresponding author
Additional information
Original Russian Text © Yu.A. Boikov, T. Claeson, 2014, published in Fizika Tverdogo Tela, 2014, Vol. 56, No. 12, pp. 2361–2365.
Rights and permissions
About this article
Cite this article
Boikov, Y.A., Claeson, T. Degradation of the SrRuO3/SrTiO3 interface capacitance induced by mechanical stresses. Phys. Solid State 56, 2446–2450 (2014). https://doi.org/10.1134/S106378341412004X
Published:
Issue Date:
DOI: https://doi.org/10.1134/S106378341412004X