Semiconductors

, Volume 51, Issue 2, pp 207–212

Structural studies of ZnS:Cu (5 at %) nanocomposites in porous Al2O3 of different thicknesses

  • R. G. Valeev
  • A. L. Trigub
  • A. I. Chukavin
  • A. N. Beltiukov
Microcrystalline, Nanocrystalline, Porous, and Composite Semiconductors
  • 19 Downloads

Abstract

We present EXAFS, XANES, and X-ray diffraction data on nanoscale ZnS:Cu (5 at %) structures fabricated by the thermal deposition of a ZnS and Cu powder mixture in porous anodic alumina matrices with a pore diameter of 80 nm and thicknesses of 1, 3, and 5 μm. The results obtained are compared with data on ZnS:Cu films deposited onto a polycor surface. According to X-ray diffraction data, the samples contain copper and zinc compounds with sulfur (Cu2S and ZnS, respectively); the ZnS compound is in the cubic (sphalerite) and hexagonal (wurtzite) modifications. EXAFS and XANES studies at the K absorption edges of zinc and copper showed that, in samples deposited onto polycor and alumina with thicknesses of 3 and 5 μm, most copper atoms form the Cu2S compound, while, in the sample deposited onto a 1-μm-thick alumina layer, copper atoms form metallic particles on the sample surface. Copper crystals affect the Zn–S interatomic distance in the sample with a 1-μm-thick porous Al2O3 layer; this distance is smaller than in the other samples.

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Copyright information

© Pleiades Publishing, Ltd. 2017

Authors and Affiliations

  • R. G. Valeev
    • 1
  • A. L. Trigub
    • 1
    • 2
  • A. I. Chukavin
    • 1
  • A. N. Beltiukov
    • 1
  1. 1.Physical-Technical Institute, Russian Academy of Sciences (Ural Branch)IzhevskRussia
  2. 2.National Research Center “Kurchatov Institute”MoscowRussia

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