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A Study on Uniformity Characteristics of a Magnetized Inductively Coupled Plasma

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Abstract

Non-uniformities in the plasma parameters in a magnetized inductively coupled plasma (M-ICP) etcher were investigated. Further in text of this article the silicon dioxide and the photoresist are called as abbreviations the oxide and the PR accordingly. The etch results of an oxide and PR were correlated with the non-uniformity characteristics of the plasma parameters. The plasma density non-uniformities and the oxide etch-rate non-uniformities in M-ICP-V (9.28 and 2.4%, respectively) were lower than those in M-ICP-A (14.6% and 21.4%, respectively) or ICP (13.03 and 5.2%, respectively). The profile angle of the etched silicon dioxide in ICP, M-ICP-A, and M-ICP-V configurations were also measured and the angle in M-ICP-V was approximately 85° and similar in ICP.

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Funding

This study was supported by the Academic Research Fund of Hoseo University in 2016 (2016-0280).

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Authors and Affiliations

  1. Graduate School of Management of Technology, Hoseo University, Asan, Korea

    Hee-Woon Cheong

  2. Samsung Electronics Co. Ltd., Hwaseong, Korea

    Woohyun Lee & Ji-Won Kim

  3. Department of Applied Statistics, Hoseo University, Asan, Korea

    Sujin Cha

  4. Department of Electrical and Computer Engineering, Seoul National University, Seoul, Korea

    Kyoungji Kim

  5. Hyundai Motor Company, Hwaseong, Korea

    Hwally Lee

Authors
  1. Hee-Woon Cheong
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  2. Woohyun Lee
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  3. Ji-Won Kim
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  4. Sujin Cha
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  5. Kyoungji Kim
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  6. Hwally Lee
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Corresponding author

Correspondence to Hwally Lee.

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Hee-Woon Cheong and Woohyun Lee contributed equally to this paper.

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Hee-Woon Cheong, Lee, W., Kim, JW. et al. A Study on Uniformity Characteristics of a Magnetized Inductively Coupled Plasma. Plasma Phys. Rep. 46, 328–335 (2020). https://doi.org/10.1134/S1063780X20030034

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  • DOI: https://doi.org/10.1134/S1063780X20030034

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