Abstract
The Ge/Ge x Si1–x /Si(001) (x = 0.2–0.6) heterostructures grown by the molecular epitaxy method are analyzed using high-resolution electron microscopy with atomic resolution. The thickness of the Ge x Si1–x buffer layer is 7–35 nm. It is shown that such heterostructures relax in two stages: an ordered network of edge dislocations is formed during their growth (500°C) at the Ge/GeSi interface and then, contrary to the generally accepted opinion concerning their immobility, some of the edge dislocations move through the buffer GeSi layer to the GeSi/Si(001) interface during annealing at higher temperatures and x > 0.3. It is found that plastic relaxation of the GeSi buffer layer occurs due to motion of dislocation complexes of the edge type, consisting of a pair of complementary 60° dislocations with the ends of {111} extra planes located approximately at a distance from 2 to 12 interplanar spacings. It is shown that the penetration of dislocation complexes into the GeSi buffer layer and further to the GeSi/Si interface is intensified with increasing annealing temperature (600–800°C) and the fraction of Ge in the buffer layer.
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Original Russian Text © Yu.B. Bolkhovityanov, A.K. Gutakovskii, A.S. Deryabin, L.V. Sokolov, 2016, published in Zhurnal Eksperimental’noi i Teoreticheskoi Fiziki, 2016, Vol. 150, No. 5, pp. 955–962.
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Bolkhovityanov, Y.B., Gutakovskii, A.K., Deryabin, A.S. et al. Experimental observation of motion of edge dislocations in Ge/Ge x Si1–x /Si(001) (x = 0.2–0.6) heterostructures. J. Exp. Theor. Phys. 123, 832–837 (2016). https://doi.org/10.1134/S1063776116110042
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DOI: https://doi.org/10.1134/S1063776116110042