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Structure of Dispersion-Reinforced Copper Substrate Tapes for 2G HTS

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Abstract

Some features of the structure formation and mechanical characteristics of dispersion-reinforced copper substrate tapes have been studied during their manufacture. The change in the structure of the matrix phase and the properties of reinforcing particles dispersed in it have been investigated after col rolling and recrystallization annealing. Particular attention is paid to the possible impact of the dispersed phase on the texture of metallic substrate tapes, since the perfect texture of a tape ensures a further growth of buffer and superconducting layers on it. It is shown that alloying of the copper matrix with iron particles does not degrade the tendency to formation of a sharp cube texture.

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ACKNOWLEDGMENTS

The authors are grateful to Yu.V. Khlebnikova, M.N. Mikheev Institute of Metal Physics, Ural Branch of the Russian Academy of Sciences, for providing tape samples.

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Authors and Affiliations

  1. Ginzburg Center for High-Temperature Superconductivity and Quantum Materials, Lebedev Physical Institute, Russian Academy of Sciences, 119991, Moscow, Russia

    A. Yu. Degtyarenko

  2. Joint Institute for High Temperatures, Russian Academy of Sciences, 125412, Moscow, Russia

    A. Yu. Degtyarenko

  3. National Research Centre “Kurchatov Institute”, 123098, Moscow, Russia

    E. A. Golovkova, A. S. Ivanov, A. V. Ovcharov & S. V. Krasheninnikov

Authors
  1. A. Yu. Degtyarenko
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  2. E. A. Golovkova
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  3. A. S. Ivanov
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  4. A. V. Ovcharov
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  5. S. V. Krasheninnikov
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Correspondence to A. Yu. Degtyarenko.

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The authors declare that they have no conflicts of interest.

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Translated by E. Bondareva

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Degtyarenko, A.Y., Golovkova, E.A., Ivanov, A.S. et al. Structure of Dispersion-Reinforced Copper Substrate Tapes for 2G HTS. Crystallogr. Rep. 67, 172–177 (2022). https://doi.org/10.1134/S1063774522020031

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  • DOI: https://doi.org/10.1134/S1063774522020031

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