Abstract—
In this paper, simulation of the structure at some stages of fabrication of a microassembly with embedded dies using FOWLP technology was carried out. The data on the values of thermomechanical deformations and stresses in the structure of the sample consisting of a steel ring, temporary carrier, dies and layers of polyimide and epoxy compound taking into account temperature effects in the manufacturing process route were obtained. The presented results can be used for further improvement of the technological process of chip packaging at the wafer level.
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The work was financially supported by a grant from the Russian Science Foundation (project no. 23-29-00964).
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Evstafyev, S.S., Solovyov, I.A., Kochergin, M.D. et al. Research and Analysis of Thermomechanical Stresses in the Structure of a Wafer with Embedded ICs with Consideration of Temperature Effects in Manufacturing Process Route. Russ Microelectron 52 (Suppl 1), S251–S256 (2023). https://doi.org/10.1134/S1063739723600371
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DOI: https://doi.org/10.1134/S1063739723600371