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Investigation of the Characteristics of a Wireless Communication System Consisting of Metal Nanoantennas in 50 µM TSV Channel

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Abstract

In this article challenges and potential solutions in the field of signal exchange between layers of a 3D integrated circuit (IC) using through silicon vias (TSVs) are discussed. The current technology uses copper channels, but it has limitations such as stress along the TSV joint and oxidation of copper during operation, which can affect the transmission characteristics and service life of the product. We propose a solution by replacing copper channels with nanophotonics technology, specifically optical antennas capable of wireless signal transmission. This technology has shown potential for high-speed data transmission with frequencies reaching hundreds of THz. A series of simulations was conducted in order to evaluate abilities of nanoantennas transmitter-receiver system to send data to a distance of 50 microns. Calculated results show, that wireless optical antennas communication system is able to send signal to such interval, but further studies are necessary to explore potential capabilities of dielectric and metal antennas in this area.

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This work was supported by ongoing institutional funding. No additional grants to carry out or direct this particular research were obtained.

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  1. Valiev Institute of Physics and Technology, Russian Academy of Sciences, 117218, Moscow, Russia

    D. A. Serov & I. A. Khorin

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  1. D. A. Serov
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  2. I. A. Khorin
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Correspondence to D. A. Serov or I. A. Khorin.

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Serov, D.A., Khorin, I.A. Investigation of the Characteristics of a Wireless Communication System Consisting of Metal Nanoantennas in 50 µM TSV Channel. Russ Microelectron 52 (Suppl 1), S151–S158 (2023). https://doi.org/10.1134/S1063739723600279

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  • DOI: https://doi.org/10.1134/S1063739723600279

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