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Structural Strength and Temperature Condition of Multi-Chip Modules

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Abstract

The general principles of designing three-dimensional multichip modules are presented. The multichip modules are simulated and the effect of the design variables on the strength and temperature condition of the products is studied. The values of thermomechanical stresses, heat resistance, and overheating temperatures of the materials are determined, and the heat removal efficiency in various structural variations of three-dimensional modules is also found. Methods for providing an intensive heat transfer in the structures of the modules and increasing the strength consistency of the products are developed. Recommendations on the design of multichip modules are given.

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REFERENCES

  1. Gus’kov, G.Ya., Blinov, G.A., and Gazarov, A.A., Montazh mikroelektronnoi apparatury (Mounting of Microelectronic Devices), Moscow: Radio Svyaz’, 1986.

    Google Scholar 

  2. Grushevskii, A.M., Sborka i montazh mnogokristal’nykh mikromodulei: uch. posobie (Assembly and Mounting of Multi-Chip Micromodules, The School-Book), Koledov, L.A., Ed., Moscow: MIET, 2003.

    Google Scholar 

  3. Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Thermophysical calculations and design engineering of multilayered structures of microelectronic devices, Konstrukts. Kompoz. Mater., 2012, no. 4, pp. 3–7.

  4. Kuznetsov, O.A., Pogalov, A.I., and Sergeev, V.S., Prochnost’ elementov mikroelektronnoi apparatury (Strength of Microelectronic Devices Elements), Moscow: Radio Svyaz’, 1990.

    Google Scholar 

  5. Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Thermal burdening of functional three-dimensional multichip micromodules, Oboron. Kompleks-Nauch.-Tekh. Progressu Ross., 2013, no. 1, pp. 77–82.

  6. Feodos’ev, V.I., Soprotivlenie materialov: ucheb. dlya vuzov (Strength of Materials, The School-Book), Moscow: MGTU im. N.E. Baumana, 2000; Moscow: Mir, 1968.

  7. Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Modeling of thermal strength of multichip micromodules, Izv. Vyssh. Uchebn. Zaved., Elektron., 2010, no. 5, pp. 73–75.

  8. Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Stress-strain state and thermal conditions of multilayer glue joints of multicrystalline micromodules, Konstrukts. Kompoz. Mater., 2013, no. 2, pp. 18–22.

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Authors and Affiliations

  1. National Research University of Electronic Technology, Moscow, Russia

    A. I. Pogalov, G. A. Blinov & E. Yu. Chugunov

Authors
  1. A. I. Pogalov
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  2. G. A. Blinov
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  3. E. Yu. Chugunov
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Corresponding author

Correspondence to E. Yu. Chugunov.

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Translated by G. Levina

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Pogalov, A.I., Blinov, G.A. & Chugunov, E.Y. Structural Strength and Temperature Condition of Multi-Chip Modules. Russ Microelectron 47, 460–464 (2018). https://doi.org/10.1134/S1063739718070090

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  • DOI: https://doi.org/10.1134/S1063739718070090

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