Abstract
A microwave field-effect transistor with nonalloyed ohmic contacts is fabricated using the technique of regrowing a heavily doped region under the contact metallization by molecular beam epitaxy through a preliminarily formed dielectric mask. The fabricated field-effect transistor with a gate length of 0.18 µm and a total width of 100 µm has a current–amplification cutoff frequency of 66 GHz and ohmic contact resistivity of 0.15-0.18 Ω mm.
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Mishra, U.K., Shen, L., Kazior, T.E., and Wu, Y.F., GaN-based RF power devices and amplifiers, Proc. IEEE, 2008, vol. 96, no. 2, pp. 287–305.
Fedorov, Yu.V., Pavlov, A.Yu., Pavlov, V.Yu., Ivanova, N.E., Arutyunyan, S.S., Tomosh, K.N., and Mikhalev, A.O., Basic technology development of creation of monolithic integrated circuits for power amplifiers and low-noise amplifiers based on nitride nanoheterostructures for receiving–transmitting modules, in Mater. mezhdunarodnoi nauchno-tekhnicheskoi konferentsii INTERMATIC 2015 (Proceedings of the Conference INTERMATIC 2015, Moscow, Dec. 1–5, 2015), vol. 4, pp. 240–243.
Fedorov, Yu.V., Gnatyuk, D.L., Bugaev, A.S., Matveenko, O.S., Galiev, R.R., Zuev, A.V., Pavlov, A.Yu., and Mikhailovich, S.V., Designing gallium nitridebased monolithic microwave integrated circuits for the Ka, V, and W bands, Russ. Microelectron., 2016, vol. 45, no. 2, pp. 128–136.
Pengelly, R.S., Wood, S.M., Milligan, J.W., Sheppard, S.T., and Pribble, W.L., Review of GaN on SiC high electron-mobility power transistors and MMICs, IEEE Trans. Microwave Theory Tech., 2012, vol. 60, no. 6, pp. 1764–1783.
Chunjiang, R., Hongchang, S., Zhonghui, L., Tangsheng, C., Bin, Z., and Tao, G., GaN HEMT with AlGaN back barrier for high power MMIC switch application, J. Semicond., 2015, vol. 36, no. 1, p. 014008.
Blank, T.V. and Gol’dberg, Yu.A., Mechanisms of current flow in metal-semiconductor ohmic contacts, Semiconductors, 2007, vol. 41, no. 11, pp. 1263–1292.
Zhou, L., Johnson, M.R., Smith, D.J., Meyer, D.J., Storm, D.F., Katzer, D.S., and Downey, B.P., Microstructure of Ti/Al/Ni/Au ohmic contacts for N-polar GaN/AlGaN high electron mobility transistor devices, J. Vac. Technol. B, 2014, vol. 32, no. 1, p. 011201.
Pavlov, V.Yu. and Pavlov, A.Yu., Technologies for formation of the alloyed and unalloyed ohmic contacts to the heterostructures on the basis of GaN. Review, Nano-Mikrosist. Tekh., 2016, vol. 18, no. 10, pp. 635–644.
Wong, M.H., Pei, Y., Palacios, T., Shen, L., Chakraborty, A., McCarthy, L.S., Keller, S., Denbaars, S.P., Speck, J.S., and Mishra U.K., Low nonalloyed ohmic contact resistance to nitride high electron mobility transistors using N-face growth, Appl. Phys. Lett., 2007, vol. 91, no. 23, p. 232103.
Recht, F., McCarthy, L., Rajan, S., Chakraborty, A., Poblenz, C., Corrion, A., Speck, J.S., and Mishra, U.K., Nonalloyed ohmic contacts in AlGaN/GaN HEMTs by ion implantation with reduced activation annealing temperature, IEEE Electron Dev. Lett., 2006, vol. 27, no. 4, pp. 205–207.
Boratynski, B., Macherzynski, W., Drozdziel, A., and Pyszniak, K., Ion implanted ohmic contacts to AlGaN/GaN structures, J. Electr. Eng., 2009, vol. 60, no. 5, pp. 273–275.
Pang, L. and Kim, K., Analysis of AlGaN/GaN high electron mobility transistors with nonalloyed ohmic contacts achieved by selective area growth using plasma assisted molecular beam epitaxy, IOSR J. Eng., 2014, vol. 4, no. 2, pp. 8–13.
Guo, J., Li, G., Faria, F., Cao, Y., Wang, R., Verma, J., Gao, X., Guo, S., Beam, E., Ketterson, A., Schuette, M., Saunier, P., Wistey, M., Jena, D., and Xing, H., MBE-regrown ohmics in InAlN HEMTs with a regrowth interface resistance of 0.05 Ω mm, IEEE Electron Dev. Lett., 2012, vol. 33, no. 4, pp. 525–527.
Arutyunyan, S.S., Pavlov, A.Yu., Pavlov, V.Yu., Tomosh, K.N., and Fedorov, Yu.V., On a two-layer Si3N4/SiO2 dielectric mask for low-resistance ohmic contacts to AlGaN/GaN HEMTs, Semiconductors, 2016, vol. 50, no. 8, pp. 1117–1121.
Mokerov, V.G., Kuznetsov, A.L., Fedorov, Yu.V., Enyushkina, E.N., Bugaev, A.S., Pavlov, A.Yu., Enyushkina, E. N., Gnatyuk, D.L., Zuev, A.V., Galiev, R.R., Ovcharenko, E.N., Sveshnikov, Yu.N., Tsatsulnikov, A.F., and Ustinov, V.M., AlGaN/GaN-HEMTs with a breakdown voltage higher than 100 V and maximum oscillation frequency f max as high as 100 GHz, Semiconductors, 2009, vol. 43, no. 4, pp. 537–543.
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Original Russian Text © A.Yu. Pavlov, V.Yu. Pavlov, D.N. Slapovskiy, S.S. Arutyunyan, Yu.V. Fedorov, P.P. Mal’tsev, 2017, published in Mikroelektronika, 2017, Vol. 46, No. 5, pp. 340–346.
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Pavlov, A.Y., Pavlov, V.Y., Slapovskiy, D.N. et al. Nonalloyed ohmic contacts for high-electron-mobility transistors based on AlGaN/GaN heterostructures. Russ Microelectron 46, 316–322 (2017). https://doi.org/10.1134/S1063739717050079
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DOI: https://doi.org/10.1134/S1063739717050079