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Analyzing flaws in electric components by scanning acoustic microscopy

  • Acoustic Methods
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Abstract

Flaws that occur due to the following processes involved in the production of electronic components have been examined: soldering of crystals to pack bases; assembly of flip-chips; and sealing of integrated circuits with a plastic. The analysis has been performed by scanning acoustic microscopy.

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Authors and Affiliations

  1. Scientific Research Institute of Electric Equipment, Voronezh, 394033, Russia

    R. B. Burov

  2. Voronezh State Technical University, Voronezh, 394026, Russia

    A. A. Stoyanov, A. A. Vinokurov & V. V. Zenin

Authors
  1. R. B. Burov
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  2. A. A. Stoyanov
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  3. A. A. Vinokurov
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  4. V. V. Zenin
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Corresponding author

Correspondence to R. B. Burov.

Additional information

Original Russian Text © R.B. Burov, A.A. Stoyanov, A.A. Vinokurov, V.V. Zenin, 2017, published in Defektoskopiya, 2017, No. 9, pp. 21–25.

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Burov, R.B., Stoyanov, A.A., Vinokurov, A.A. et al. Analyzing flaws in electric components by scanning acoustic microscopy. Russ J Nondestruct Test 53, 615–619 (2017). https://doi.org/10.1134/S1061830917090042

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  • DOI: https://doi.org/10.1134/S1061830917090042

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