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The reliability of soldered joints produced at a low temperature

  • General Aspects of Nondestructive Inspection
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Abstract

Under severe service conditions of electronic instruments (at elevated temperatures and vibrations in electronic systems), failures in their operation frequently occur. Severe intrinsic thermal conditions of operating instruments may cause such failures. However, malfunctions in electronic devices may often be due to defects in soldered joints that were made at lowered temperatures. An approach is proposed that makes it possible to considerably improve the reliability of soldered joints.

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References

  1. Budai, B.T., Porodnov, B.T., Myakutina, I.V., and Kasatkin, N.V., The detection of flaws in optoelectronic systems, Russ. J. Nondestr. Test., 2012, vol. 48, no. 7, pp. 426–435.

    Article  Google Scholar 

  2. Budai, B.T., Porodnov, B.T., Myakutina, I.V., and Tovkach, E.F., The development of a high-precision environmentally friendly method for measuring the thickness of rolled sheets, Russ. J. Nondestr. Test., 2012, vol. 48, no. 8, pp. 483–487.

    Article  Google Scholar 

  3. Budai, B.T., Porodnov, B.T., Myakutina, I.V., and Kasatkin, N.V., Analysis of the possibility of eliminating defects of OES via selection of the parameters of the OES structure, Russ. J. Nondestr. Test., 2013, vol. 49, no. 1, pp. 56–64.

    Google Scholar 

  4. Shcherbinin, V.E., Kostin, V.N., Smorodinskii, Ya.G., Nichipuruk, A.P., Rinkevich, A.B., Shleenkov, A.S., Patramanskii, B.V., and Loskutov, V.E., On the measures that are necessary for providing the safe operation of pipeline transport with nondestructive testing facilities, Russ. J. Nondestr. Test., 2011, vol. 47, no. 12, pp. 842–851.

    Article  Google Scholar 

  5. Shcherbinin, V.E., Blinov, Yu.I., Shleenkov, A.S., Barmenkov, B.G., and Kostin, V.N., On the development of national standards for magnetic and eddy-current nondestructive inspection of steel pipes, Russ. J. Nodestr. Test., 2009, vol. 45, no. 10, pp. 740–743.

    Article  CAS  Google Scholar 

  6. Gorkunov, E.S., Smirnov, S.V., and Rodionova, S.S., Effect of plastic deformation under a hydrostatic pressure on the damage and magnetic characteristics of ZSP low-carbon steel, Fizich. Mezomekh., 2003, vol. 6, no. 5, pp. 101–108.

    CAS  Google Scholar 

  7. Shtennikov, V.N., A technique for providing a required temperature of contact soldering, Nano Microsyst. Technol., 2010, no. 7, pp. 30–32.

    Google Scholar 

  8. Shtennikov, V.N., Thermal characteristics of modern soldering stations, Compon. Technol., 2004, no. 9, pp. 180–182.

    Google Scholar 

  9. Mikheev, M.A. and Mikheeva, I.M., Osnovy teploperedachi. Izd. 2 (Fundamentals of Heat Transfer), 2nd Edition, Moscow: Energiya, 1977.

    Google Scholar 

  10. Manko, G., Paika i pripoi (Soldering and Solders), Moscow: Mashinostroenie, 1968.

    Google Scholar 

  11. Shtennikov, V.N., Bessvintsovye Tekhnologii v elektronnom mashinostroenii. Sborka v mashinostroenii, priborostroenii (Lead-Free Technologies in Electronic Machine Building. Assembly in Machine Building and Instrument Making), 2010.

    Google Scholar 

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Authors and Affiliations

  1. Ural Federal University, pr. Lenina 51, Yekaterinburg, 620083, Russia

    V. N. Shtennikov & B. T. Budai

Authors
  1. V. N. Shtennikov
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  2. B. T. Budai
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Correspondence to V. N. Shtennikov.

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Original Russian Text © V.N. Shtennikov, B.T. Budai, 2013, published in Defektoskopiya, 2013, Vol. 49, No. 9, pp. 68‐72.

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Shtennikov, V.N., Budai, B.T. The reliability of soldered joints produced at a low temperature. Russ J Nondestruct Test 49, 548–551 (2013). https://doi.org/10.1134/S1061830913090088

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  • DOI: https://doi.org/10.1134/S1061830913090088

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