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Doklady Physics

, Volume 63, Issue 2, pp 58–60 | Cite as

Prospects for Boiling of Subcooled Dielectric Liquids for Supercomputer Cooling

  • Yu. A. Zeigarnik
  • N. V. Vasil’ev
  • E. A. Druzhinin
  • I. V. Kalmykov
  • A. S. Kosoi
  • K. A. Khodakov
Physics
  • 20 Downloads

Abstract

It is shown experimentally that using forced-convection boiling of dielectric coolants of the Novec 649 Refrigerant subcooled relative to the saturation temperature makes possible removing heat flow rates up to 100 W/cm2 from modern supercomputer chip interface. This fact creates prerequisites for the application of dielectric liquids in cooling systems of modern supercomputers with increased requirements for their operating reliability.

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References

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    A. Bar-Cohen and C. A. Holloway, Proc. of the 15th Intern. Heat Transfer Conf., Kyoto, Japan, 2014, paper ITTC-15-FL01.Google Scholar
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    A. Bar-Cohen, ASME J. Nanotechnol. Eng. and Med., 2013, vol. 4(2), 020907, pp. 1–3.CrossRefGoogle Scholar
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    A. E. Bergles, Nuclear Safety 18 (2), 154–167 (1977).Google Scholar

Copyright information

© Pleiades Publishing, Ltd. 2018

Authors and Affiliations

  • Yu. A. Zeigarnik
    • 1
  • N. V. Vasil’ev
    • 1
    • 2
  • E. A. Druzhinin
    • 3
  • I. V. Kalmykov
    • 1
  • A. S. Kosoi
    • 1
  • K. A. Khodakov
    • 1
  1. 1.Joint Institute for High TemperaturesRussian Academy of SciencesMoscowRussia
  2. 2.Bauman Moscow State Technical University (National Research University)MoscowRussia
  3. 3.ZAO RSK TechnologiesMoscowRussia

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