Abstract
It is determined by electron microscopy that the contact layer in the Sn–(Bi + 30 wt % Pb) system contains separate solid inclusions, while the contact layer in the Sn–(Bi + 40 wt % Pb) system is microheterogeneous. The observed structural states of alloys in the contact layers are explained by a change in the concentration of the initial contacting samples. The effect of the alloy structure and electromigration on the kinetics of contact melting is found.
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Original Russian Text © V.Z. Afashokov, A.A. Akhkubekov, S.N. Akhkubekova, M.-A.V. Zubkhadjiev, B.M. Khubolov, 2016, published in Poverkhnost’, 2016, No. 7, pp. 98–101.
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Afashokov, V.Z., Akhkubekov, A.A., Akhkubekova, S.N. et al. On the effect of lead concentration on the kinetics of contact melting in the Sn–Pb–Bi system in the presence of electromigration. J. Surf. Investig. 10, 763–766 (2016). https://doi.org/10.1134/S1027451016040030
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DOI: https://doi.org/10.1134/S1027451016040030