Features of the plasma sputtering of polycrystalline Pb1 − x Sn x S films

  • S. P. ZiminEmail author
  • E. S. Gorlachev
  • I. I. Amirov
  • V. V. Naumov
  • G. A. Dubov
  • V. F. Gremenok
  • I. N. Tsyrelchuk


The processes of the sputtering and modification of surfaces of polycrystalline films of the ternary solid solution Pb1 − x Sn x S (x = 0.9–1.0) in a high-density Ar plasma of high-frequency low-pressure inductive discharge are studied. Films with thicknesses of 1–4 μm are grown on glass substrates using the “hot-wall” method and consist of plate-like crystallites. It is established that the sputtering rate for lead-tin sulfide films does not exceed 2.0 nm/s, which is determined by the presence of oxygen-containing compounds on the surfaces. In the case of plate-like crystallites with nanodimensional thicknesses, the effect of smoothing of the developed surfaces of the polycrystalline Pb1 − x Sn x S layers during plasma treatment is observed; this is important for fabricating multilayer device structures.


Plasma Treatment Neutron Technique Atomic Force Micro Surface Microrelief Ternary Solid Solution 
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Copyright information

© Pleiades Publishing, Ltd. 2014

Authors and Affiliations

  • S. P. Zimin
    • 1
    Email author
  • E. S. Gorlachev
    • 1
    • 2
  • I. I. Amirov
    • 2
  • V. V. Naumov
    • 2
  • G. A. Dubov
    • 1
  • V. F. Gremenok
    • 3
    • 4
  • I. N. Tsyrelchuk
    • 4
  1. 1.Yaroslavl State UniversityYaroslavlRussia
  2. 2.Institute of Physics and Technology, Yaroslavl BranchRussian Academy of SciencesYaroslavlRussia
  3. 3.Scientific-Practical Material Research CenterNational Academy of Sciences of BelarusMinskBelarus
  4. 4.Belarus State University of Informatics and RadioelectronicsMinskBelarus

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