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In-situ Study the Corrosion Degradation Mechanism of Tinplate in Salty Water by Scanning Electrochemical Microscopy

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Abstract

In this work, the corrosion degradation of tinplate in contact with salty water is investigated by scanning electrochemical microscopy (SECM) electrochemical impedance spectroscopy (EIS). Experimental results indicate tin maintains at passive state during the exposure; however, pores and defects existed in tin coating leads to an exposure of carbon steel substrate to the electrolyte, in which localized corrosion tends to occur within the pore. A phenomenological model is proposed to interpret corrosion mechanism of tinplate in contact with salty food based on the proposed electrochemical equivalent circuit.

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Authors and Affiliations

  1. Tianjin Key Laboratory of Composite and Functional Materials, School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, People’s Republic of China

    Chao Ma, Da-Hai Xia, Zhi-Ming Gao & Wen-Bin Hu

  2. CAS Key Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, Liaoning, 110016, People’s Republic of China

    Jian-Qiu Wang & Zhi-Ming Zhang

  3. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta, Canada, T6G 2V4

    Yashar Behnamian

  4. CNPC Research Institute of Engineering Technology, Tianjin, 300451, People’s Republic of China

    Bing Zhou

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  1. Chao Ma
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  2. Bing Zhou
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  3. Da-Hai Xia
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Correspondence to Da-Hai Xia.

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Ma, C., Zhou, B., Xia, DH. et al. In-situ Study the Corrosion Degradation Mechanism of Tinplate in Salty Water by Scanning Electrochemical Microscopy. Russ J Electrochem 54, 216–223 (2018). https://doi.org/10.1134/S1023193517120060

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  • DOI: https://doi.org/10.1134/S1023193517120060

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