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Bottom-up filling in electroless plating with an addition of JGB-RPE

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Abstract

Bottom-up filling of copper for different sub-micrometer trenches was investigated by electroless deposition technique using Janus Green B (JGB) and Triblock copolymers RPE-2520. The bottom-up copper filling usually achieves a relative high deposition rate of copper in the bottom of trenches through inhibiting the surface deposition or accelerating the bottom deposition of copper. The bottom-up filling behavior of electroless copper deposition for different trenches was investigated in a plating bath containing 0.3 mg/L JGB and 1.0 mg/L RPE-2520. The cross-section image with SEM indicated that the trenches with different widths ranging from 110 to 520 nm were completely filled with electroless copper and that no void was found.

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Authors and Affiliations

  1. College of Science, Lishui University, Lishui, 323000, China

    Xu Wang

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  1. Xu Wang
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Correspondence to Xu Wang.

Additional information

Published in Russian in Elektrokhimiya, 2014, Vol. 50, No. 5, pp. 490–495.

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Wang, X. Bottom-up filling in electroless plating with an addition of JGB-RPE. Russ J Electrochem 50, 438–443 (2014). https://doi.org/10.1134/S1023193514050103

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  • DOI: https://doi.org/10.1134/S1023193514050103

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