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Effect of additive triblock copolymer PEP-3100 on bottom-up filling in electroless copper plating

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Abstract

Bottom-up copper filling for different sub-micrometer trenches was investigated by electroless deposition technique using a PO-EO-PO triblock copolymer termed PEP-3100 as an additive. It was found that PEP-3100 (molecular weight 3100) had a strong inhibition for the electroless copper deposition. The bottom-up filling behavior of electroless copper bath for different trenches was investigated in a plating bath containing 1.0 mg l−1 PEP-3100. The cross-section SEM observation indicated the trenches with different widths ranging from 100 to 380 nm were all filled completely by electroless copper.

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Authors and Affiliations

  1. Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education, and School of Chemistry and Materials Science, Shaanxi Normal University, Xi’an, 710062, China

    Xu Wang, Zhifeng Yang & Zenglin Wang

  2. College of Chemistry and Life Science Lishui University, Lishui, 323000, China

    Xu Wang

Authors
  1. Xu Wang
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  2. Zhifeng Yang
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  3. Zenglin Wang
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Correspondence to Zenglin Wang.

Additional information

Published in Russian in Elektrokhimiya, 2012, Vol. 48, No. 1, pp. 108–112.

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Wang, X., Yang, Z. & Wang, Z. Effect of additive triblock copolymer PEP-3100 on bottom-up filling in electroless copper plating. Russ J Electrochem 48, 99–103 (2012). https://doi.org/10.1134/S1023193511120135

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  • DOI: https://doi.org/10.1134/S1023193511120135

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