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Electrodeposition of copper on metal-filled composite support

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Abstract

When a metal is deposited onto low-conductive supports, the metal deposit propagates from the contact site over the electrode surface. In the work, a mathematic model of variation in the overvoltage in the course of galvanostatic growth of copper deposit is proposed. The model takes into account the kinetic parameters of electrodeposition and geometric characteristics of growing deposit, which were obtained by using independent measurements. The chronopotentiograms, which were calculated by the model, agree satisfactorily with the experimental data. This allows one to apply the model proposed for estimating the tangential growth rate by the kinetic parameters of electrodeposition and structural characteristics of deposit.

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Authors and Affiliations

  1. Yeltsin Ural State Technical University, ul. Mira 19, Yekaterinburg, 620002, Russia

    V. M. Rudoi, T. N. Ostanina, A. B. Darintseva, N. I. Ostanin, I. A. Alikhanova, S. L. Demakov & A. S. Prokof’eva

Authors
  1. V. M. Rudoi
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  2. T. N. Ostanina
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  3. A. B. Darintseva
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  4. N. I. Ostanin
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  5. I. A. Alikhanova
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  6. S. L. Demakov
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  7. A. S. Prokof’eva
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Corresponding author

Correspondence to V. M. Rudoi.

Additional information

Original Russian Text © V.M. Rudoi, T.N. Ostanina, A.B. Darintseva, N.I. Ostanin, I.A. Alikhanova, S.L. Demakov, A.S. Prokof’eva, 2010, published in Elektrokhimiya, 2010, Vol. 46, No. 6, pp. 747–752.

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Rudoi, V.M., Ostanina, T.N., Darintseva, A.B. et al. Electrodeposition of copper on metal-filled composite support. Russ J Electrochem 46, 702–706 (2010). https://doi.org/10.1134/S1023193510060157

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  • DOI: https://doi.org/10.1134/S1023193510060157

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