Abstract
The effects of organic additive, 3-S isothiuronium propyl sulfonate (UPS) on bath stability, deposition rate, reaction activation energy, and Ni-P coating composition in acidic electroless nickel (EN) plating were investigated. The study was performed by measuring the polarization curves and X-ray fluorescence spectrometer (XRF) in combination with X-ray photoelectron spectroscopy (XPS) analysis. The results show that UPS improves bath stability and increases the reaction activation energy. At lower concentration, UPS is an effective accelerator for EN deposition; whereas, at higher concentration, it decreases deposition rate. It also reveals that UPS inhibits the anodic oxidation of hypophosphite and accelerates the cathodic reduction. In addition, UPS decreases the phosphorus content in Ni-P deposit and can be adsorbed on the deposit surface and compound with Ni2+. On the basis of these results, the effect mechanism of UPS on electroless nickel deposition was deduced.
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Liu, H., Bi, S. & Li, N. Effect of 3-S isothiuronium propyl sulfonate on electroless nickel deposition. Russ J Electrochem 46, 383–388 (2010). https://doi.org/10.1134/S1023193510040038
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DOI: https://doi.org/10.1134/S1023193510040038