Abstract
Electroless deposited Ni-P and Co-P coatings, modified by introducing additional elements such as Zn and W are presented. The characteristics alterations of the multicomponent films are reviewed in connection with the particularities of co-deposition of the third metal. Based on the fair correspondence between TEM, microdiffraction and precise XRD analysis it is shown that the structure type and lattice parameters of polycrystalline Ni-Me-P and Co-Me-P films are practically identical to pure Ni and Co metals. No impurity phase is detected by XRD. The location of the third element is determined using TEM with EDS. The conclusion is drawn about the grain boundary segregation of Zn and W along with P. Earlier studies by XPS and AES showed that Zn is partially oxidized, whereas W is in elemental form inside the coatings. Crystallites built of lamellas with thickness within the nanometer scale are observed in Ni-W-P and Co-W-P by TEM.
Similar content being viewed by others
References
Brenner, A. and Riddell, G., J. Res. Nation. Bur. Stand., 1946, vol. 37, p. 31.
Brenner, A. and Riddell, G., J. Res. Nation. Bur. Stand., 1947, vol. 39, p. 385.
Gorbunova, K.M. and Nikiforova, A.A., Fizikokhimicheskie osnovy processa khimicheskogo nikelirovaniya, Moscow: Nauka, 1960.
Gorbunova, K.M., Nikiforova, A.A., Sadakov, G.A., Moiseev, V.P., and Ivanov, M.V., Fiziko-khimicheskie osnovy processa khimicheskogo kobal’tirovaniya, Moscow: Nauka, 1974.
Gawrilov, G., Chemische (stromlose) Vernicklung, Saulgau, Wiirttenberg: Eugen G. Verlag, 1974.
Vishenkov, S.A., Khimicheskie i elektrokhimicheskie sposoby osazhdeniya metallopokrytij, Moscow: Mashinostroenie, 1975.
Šalkauskas, M. and Vaškelis, A., Khimicheskoe metallizirovanie plastmass., 3d ed., Leningrad: Khimiya, 1985.
Khimicheskoe osazhdenie metallov iz vodnyh rastvorov, Sviridov, V.V., Ed., Minsk: Izdatel’stvo Universiteta, 1987.
Electroless Plating: Fundamentals and Application, Mallory, G. and Hajdu, J., Eds., Orlando, FL, USA: AESFS, 1990.
Riedel, W., Electroless Nickel Plating, Finishing Publications, England and ASM International, USA, 1991.
Paunovic, M. and Schlesinger, M., Fundamentals of Electrochemical Deposition, Electrochem. Soc. Series, Wiley-Interscience, John Wiley and Sons, 1998, ISBN 0-471-16820-3.
Modern Electroplating, Electrochem. Soc. Series, Schlesinger, M. and Paunovic, M., Eds., Wiley-Interscience, John Wiley and Sons, 2000, ISBN 0-471-16824-6.
Watanabe, T., Nano-Plating. Microstructure Control Theory of Plated Film and Data Base of Plated Film Micro Structure, London: Elsevier, 2004.
Armyanov, S., Soviet Electrochemistry, 1986, vol. 22, p. 945.
Armyanov, S. and Sotirova, G., J. Electrochem. Soc., 1989, vol. 136, p. 1575.
Osaka, T., Homma, T., Noda, K., Watanabe, T., and Goto, F., IEEE Trans. Magnet., 1991, vol. 27, p. 4963.
Lu, G. and Zangari, G., Electrochim. Acta, 2002, vol. 47, p. 2969.
Wu, F.B., Tien, S.K., Chen, W.Y., and Duh, J.G., Surf. Coat. Tech., 2004, vol. 177–178, p. 312.
O’sullivan, E.J., Schrott, A.G., Paunovic, M., Sambucetti, C.J., Marino, J.R., Bailey, P.J., Kaja, S., and Semkow, K.W., IBM J. Res. Develop., 1998, vol. 42, p. 607.
Shacham-Diamand, Y. and Lopatin, S., Microelectronic Engineering, 1997, vol. 37/38, p. 77.
Hu, C.-K., Gignac, L., Rosenberg, R., Liniger, E., Rubino, J., Sambucetti, C., Domenicucci, A., Chen, X., and Stamper, A.K., Applied Physics Letters, 2002, vol. 81, p. 1782.
Hu, C.-K., Gignac, L., Rosenberg, R., Liniger, E., Rubino, J., Sambucetti, C., Stamper, A.K., Domenicucci, A., and Chen, X., Microelectronic Engineering, 2003, vol. 70, p. 406.
Kohn, A., Eizenberg, M., and Shacham-Diamand, Y., Appl. Surf. Science, 2003, vol. 212–213, p. 367.
Chen, G.S., Chen, S.T., Louh, R.F., Yang, T.J., and Lin, C.K., Electrochem. Solid State Lett., 2004, vol. 7, p. C17.
Chen, S.T. and Chen, G.S., J. Electrochem. Soc., 2004, vol. 151, p. D99.
Kohn, A., Eizenberg, M., and Shacham-Diamand, Y., J. Appl. Phys., 2003, vol. 94, p. 3810.
Brooman, E.W., Metal Finishing, 2004, vol. 102, no. 9, p. 75.
Brooman, E.W., Metal Finishing, 2004, vol. 102, no. 10, p. 42.
Hono, K. and Laughlin, D.E., J. Magnetism Magn. Mater., 1989, vol., 80, p. L137.
Kohn, A., Eizenberg, M., Shacham-Diamand, Y., Israel, B., and Sverdlov, Y., Microelectronic Engineering, 2001, vol. 55, p. 297.
Kohn, A., Eizenberg, M., Shacham-Diamand, Y., and Sverdlov, Y., Materials Science and Engineering A, 2001, vol. 302, p. 18.
Valova, E., Armyanov, S., Franquet, A., Petrov, K., Kovacheva, D., Dille, I., Delplancke, J.-L., Hubin, A., Steenhaut, O., and Vereecken, J., J. Electrochem. Soc., 2004, vol. 151, p. C385.
Armyanov, S., Valova, E., Franquet, A., Dille, J., Delplancke, J.-L., Hubin, A., Steenhaut, O., Kovacheva, D., Tatchev, D., and Vassilev, Ts., J. Electrochem. Soc., 2005, vol. 152, p. C612.
Valova, E., Armyanov, S., Tatchev, D., Dille, J., Delplancke, J.-L., Hubin, A., Steenhaut, O., and Franquet, A., Proc. Nanostructured Materials in Electroplating, International Workshop (Sandanski, Bulgaria, 2006), Sofia: IPC BAS, 2006, p. 104.
Schlesinger, M., Meng, X., and Snyder, D., J. Electrochem. Soc., 1990, vol. 137, p. 1858.
Schlesinger, M., Meng, X., and Snyder, D., J. Electrochem. Soc., 1991, vol. 138, p. 406.
Schlesinger, M. and Snyder, D., U.S. Pat. 5 304 403, 1994.
Oulladj, M., Saidi, D., Chassaing, E., and Lebaili, S., J. Materials Science, 1999, vol. 34, p. 2437.
Bouanani, M., Cherkaoui, F., Fratesi, R., Roventi, G., and Barucca, G., J. Appl. Electrochem., 1999, vol. 29, p. 637.
Bouanani, M., Cherkaoui, F., Cherkaoui, M., Belcadi, S., Fratesi, R., and Roventi, G., J. Appl. Electrochem., 1999, vol. 29, p. 1171.
Veeraraghavan, B., Haran, B., Kumaraguru, S.P., and Popov, B., J. Electrochem. Soc., 2003, vol. 150, p. B131.
Veeraraghavan, B., Kumaraguru, S.P., Haran, B., and Popov, B., Proc. the AESF SUR/FLN 2003, Annual International Technical Conference (Milwaukee, Wisconsin, 2003), Orlando, FL, USA: AESF Inc., 2003, p. 561.
Veeraraghavan, B., Prabu, S., Haran, B., and Popov, B., Magnetic Materials, Processes and Devices VII and Electrodeposition of Alloys, Proc. the International Symposia, Proceedings Volume 2002-27, Krongelb, S., Romankiw, L.T., Chang, J.-W., Kitamoto, Y., Judy, J.W., Bonhote, C., Zangari, G., and Schwarzacher, W., Eds., Pennington, NJ, USA: The Electrochemical Society, 2003, p. 601.
Wang, S., Xu, X., and Wu, H., J. Chinese Soc. Corr. And Protect., 2004, vol. 24, p. 297.
Veeraraghavan, B., Kim, H., and Popov, B., Electrochim. Acta, 2004, vol. 49, p. 3143.
Hamid, Z.A., Ghanem, W.A., and Abo El Enin, S.A., Surf. Interface Analysis, 2005, vol. 37, p. 792.
Mallory, G.O., Plat. Surf. Finish., 1985, vol. 72, no. 6, p. 86.
Armyanov, S., Met. Finish., 1992, vol. 79, no. 7, p. 36.
Armyanov, S., Valova, E., Delplancke, J.-L., Winand, R., Steenhaut, O., and Vereecken, J., J. Electrochem. Soc., 1996, vol. 143, p. 2804.
Armyanov, S., Steenhaut, O., Krasteva, N., Georgieva, J., Delplancke, J.-L., Winand, R., and Vereecken, J., J. Electrochem. Soc., 1996, vol. 143, p. 3692.
Valova, E., Georgiev, I., Armyanov, S., Delplancke, J.-L., Tachev, D., Tsacheva, Ts., and Dille, J., J. Electrochem. Soc., 2001, vol. 148, p. C266.
Valova, E., Armyanov, S., Franquet, A., Steenhaut, O., Hubin, A., Vereecken, J., and Delplancke, J.-L., J. Electrochem. Soc., 2001, vol. 148, p. C274.
Weissmiiller, J., Proc. 22nd Riso Intern. Symp. Mater. Sci: Science of Metastable and Nanocrystalline Alloys, Structure, Properties and Modelling, Dinesen, A.R. et al., Eds, Ris, Denmark: National Lab. Roskilde, 2001.
Armyanov, S., Chakarova, G., Vangelova, T., and Pojarlieva, Ts., Bulgarian patent 47 282, 1986.
Lyunyatskas, A.M., Tarozaite, R., Gyanutene, I., and Lyaukonis, Yu., Zh. Prikl. Khim., 1978, vol. 51, p. 1797.
Bielinski, J., Goldon, A., Socko, B., and Bielinska, A., Metalloberflaeche, 1983, vol. 37, p. 300.
Bielinski, J., Metalloberflaeche, 1984, vol. 38, p. 1.
Kong, L.T., Liu, J.B., Lai, W.S., and Liu, B.X., J. Alloys Compd., 2002, vol. 337, p. 143.
Rafaja, D., Mater. Struct., 2000, vol. 7, no. 2, p. 43.
Rauscher, G., Rogoll, V., Baumgaertner, M.E., and Raub, Ch.J., Trans. Inst. Metal Finish., 1993, vol. 71, no. 3, p. 95.
Yao, S., Guo, H., and Kowaka, M., Proc. 183rd Meeting of the American Electrochemical Society (Hawaii, 1993), p. 108.
Song, Z., Bao, X., and Muhler, M., Appl. Surf. Sci., 1999, vol. 148, p. 241.
Armyanov, S., Electrochim. Acta, 2000, vol. 45, p. 3323.
Cebollada, F., Gonzalez, J.M., de Julian, C., and Surinach, S., Phys. Rev. B, 1997, vol. 56, p. 6056.
Cebollada, F., Gonzalez, J.M., and Gonzalez, J., J. Appl. Phys., 1993, vol. 73, p. 5372.
Cobalt Monograph, Centre d’Information du Cobalt, 35 Rue des Colonies, Brussels, 1960, p. 75
Kronmueller, H. and Moser, N., Chapter 17 in Amorphous Metallic Alloys, Luborsky, F.E., Ed., London: Butterworths, 1983.
Author information
Authors and Affiliations
Corresponding author
Additional information
Published in Russian in Elektrokhimiya, 2008, Vol. 44, No. 6, pp. 764–770.
The text was submitted by the authors in English.
Rights and permissions
About this article
Cite this article
Valova, E., Armyanov, S. Localization and chemical state of the third element (Zn, W) in electrolessly deposited nanocrystalline Ni-Zn-P, Ni-W-P and Co-W-P coatings. Russ J Electrochem 44, 709–715 (2008). https://doi.org/10.1134/S1023193508060116
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1134/S1023193508060116