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Effect of the displacement reaction on the composition of the magnetic layer in electrodeposited layered nanostructures Co-Cu/Cu and Ni-Cu/Cu

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Abstract

Methods of stripping voltammetry, quartz microgravimetry, and x-ray-fluorescence analysis are employed to explore the copper displacement process on thin electrodeposited layers of pure cobalt and nickel and on deposits of these metals with inclusions of copper. The displacement reaction proceeds at a considerable rate on cobalt in the sulfate and sulfosalicylate solutions and virtually does not proceed on nickel in both the sulfate or sulfate-chloride solutions. An estimate of the rate of the copper displacement reaction following a change in the concentration of copper ions in the solution and in the pH of the sulfosalicylate solution is given. A decrease in the contact exchange rate is facilitated by a decrease in the concentration of copper ions in solution and their participation in the formation of complexes.

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Authors and Affiliations

  1. Institute of Solid-State Chemistry and Mechanochemistry, Siberian Division, Russian Academy of Sciences, ul. Michurina 15, Novosibirsk, 630091, Russia

    S. N. Ovchinnikova & A. I. Maslii

Authors
  1. S. N. Ovchinnikova
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  2. A. I. Maslii
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Correspondence to S. N. Ovchinnikova.

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Original Russian Text © S.N. Ovchinnikova, A. I. Maslii, 2006, published in Elektrokhimiya, 2006, Vol. 42, No. 11, pp. 1376–1384.

Based on the report delivered at the 8th International Frumkin Symposium “Kinetics of the Electrode Processes,” October 18–22, 2005, Moscow.

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Ovchinnikova, S.N., Maslii, A.I. Effect of the displacement reaction on the composition of the magnetic layer in electrodeposited layered nanostructures Co-Cu/Cu and Ni-Cu/Cu. Russ J Electrochem 42, 1235–1243 (2006). https://doi.org/10.1134/S1023193506110103

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  • DOI: https://doi.org/10.1134/S1023193506110103

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