Abstract
A technique for obtaining binary Cu-Sn alloys containing 20–35 mol % Sn is proposed. The technique—the electrochemical deposition out of silicofluoride electrolytes—ensures a high deposition rate of coatings (25–50 μm h−1). The formation of intermetallic compound Cu10Sn3 is found to occur at a high current density, in conditions of the tin reduction depolarization and the copper reduction superpolarization. The alloys consist of submicron grains. Apart from crystalline Cu10Sn3, they include x-ray-amorphous tin (2–12 mol %) and tin oxides (≤1–3 mol %). The alloys feature high hardness (4200 MPa), corrosion resistance, and solderability.
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Original Russian Text © O.V. Reva, T.N. Vorobyova, B.V. Kuznetsov, 2006, published in Elektrokhiniya, 2006, Vol. 42, No. 1, pp. 44–51.
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Reva, O.V., Vorobyova, T.N. & Kuznetsov, B.V. Alloying during codeposition of copper and tin out of silicofluoride electrolytes. Russ J Electrochem 42, 38–44 (2006). https://doi.org/10.1134/S1023193506010071
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DOI: https://doi.org/10.1134/S1023193506010071