Abstract
Diaminodiphenyl sulfone is used as a curing agent to obtain an epoxy-resin-based binder with improved thermal stability. The kinetics of curing of this composition is studied by rheokinetic and calorimetric methods. It is shown that complete conversion is attained at a temperature of 200°С or higher. The rate of viscosity increase in the course of time in curing under flow conditions does not depend on the shear rate; the viscosity changes monotonically. The curing reaction occurs in the homogeneous mode without separation of a crosslinked polymer; it is described by a second-order equation with self-deceleration at low temperatures. The rheokinetic characteristics and temperature dependences of kinetic parameters of the process are determined.
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Original Russian Text © M.P. Arinina, V.A. Kostenko, I.Yu. Gorbunova, S.O. Il’in, A.Ya. Malkin, 2018, published in Vysokomolekulyarnye Soedineniya, Seriya A, 2018, Vol. 60, No. 5, pp. 418–425.
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Arinina, M.P., Kostenko, V.A., Gorbunova, I.Y. et al. Kinetics of Curing of Epoxy Oligomer by Diaminodiphenyl Sulfone: Rheology and Calorimetry. Polym. Sci. Ser. A 60, 683–690 (2018). https://doi.org/10.1134/S0965545X18050012
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DOI: https://doi.org/10.1134/S0965545X18050012