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Electroplating kinetics of a nickel-tungsten alloy

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Abstract

Electroplating a nickel-tungsten alloy under various electrolysis conditions (direct and alternating current) is studied. A radical-film mechanism of the alloy formation by the cathodic deposition is experimentally proved. The effect of sorption processes at the film-electrolyte boundary on the alloy formation, as well as the possibility of controlling the film composition and structure by changing the electric field intensity, is studied. Deposits with a content of the high-melting component of up to 61% are obtained.

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Authors and Affiliations

  1. Ivanovo State Chemical-Technological University, pr. Engelsa 7, Ivanovo, 153460, Russia

    V. L. Kotov & M. V. Shmukler

Authors
  1. V. L. Kotov
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  2. M. V. Shmukler
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Original Russian Text © V.L. Kotov, M.V. Shmukler, 2006, published in Zashchita Metallov, 2006, Vol. 42, No. 2, pp. 168–172.

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Kotov, V.L., Shmukler, M.V. Electroplating kinetics of a nickel-tungsten alloy. Prot Met 42, 153–157 (2006). https://doi.org/10.1134/S0033173206020093

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  • DOI: https://doi.org/10.1134/S0033173206020093

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