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The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder

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Abstract

This research investigated changes in the properties of Sn–4.0Zn–0.7Cu (SZC407) solder alloy after doping with 0.5 wt % Ni. Specimens of SZC407 and SZC407–0.5Ni solder alloys were characterized in terms of chemical composition, microstructure, mechanical properties, and melting point. The results showed that the addition 0.5 wt % Ni had no significant effect on the ultimate tensile strength and elongation of SZC407 solder alloy but the formation of phases of the intermetallic compound (IMC) CuZnNi in the solder matrix increased the microhardness of the alloy. These IMC phases improved the strength of the solder matrix by the dispersion strengthening mechanism. The fracture surface of both solder alloys was typical of the ductile fracture mode. The microstructure of the solder alloy was improved by the distribution in the solder matrix of new CuZnNi IMC phases. However, the addition of 0.5 wt % Ni slightly increased the solidus and liquidus temperatures, pasty range and peak temperature of the SZC407 solder alloy.

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ACKNOWLEDGMENTS

The authors wish to thank academician Thomas Duncan Coyne for improving the English in this paper.

Funding

This work was supported by the Faculty of Science Research Fund, Prince of Songkla University Contract no. 1-2565-02-002.

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Authors and Affiliations

  1. Materials Science Program, Division of Physical Science, Faculty of Science, Prince of Songkla University (PSU), 90110, Hat Yai, Songkhla, Thailand

    Panisara Sukhontapatipak &  Phairote Sungkhaphaitoon

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  1. Panisara Sukhontapatipak
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  2. Phairote Sungkhaphaitoon
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Correspondence to Phairote Sungkhaphaitoon.

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Panisara Sukhontapatipak, Phairote Sungkhaphaitoon The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder. Phys. Metals Metallogr. 124, 1597–1605 (2023). https://doi.org/10.1134/S0031918X23600082

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