Abstract
The surface tensions of pure copper and its alloys with antimony, tin, and indium have been measured for free surfaces and grain boundaries. The measurements have been conducted at 1000°C in a hydrogen atmosphere by the zero-creep method in combination with the thermal-grooving method. The surface-tension isotherms satisfy the Szyszkowski’s equation. Based on the data obtained, the values of adsorptive capacity of free surface and grain boundaries (z FS and z GB), constants of adsorption equilibrium (b FS and b GB), occupancies (fraction of occupied sites θ), and free energies of binding of impurity atoms with the surface (ΔF) have been calculated. All these parameters for copper alloys with Sb, Sn, and In within their solid solutions as well as for alloys with Sb, Bi, and Au at other temperatures based on the data obtained by the other authors have been compared.
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Original Russian Text © S.N. Zhevnenko, 2008, published in Fizika Metallov i Metallovedenie, 2008, Vol. 106, No. 3, pp. 286–293.