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Electrochemical deposition of Ag–Sn alloys onto copper and titanium plates

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Abstract

In this paper, we report a detailed study of the thermal properties of a peritectic Ag–Sn alloy electrochemically deposited onto copper and titanium plates in order to produce soldered contact structures. A comparative analysis of Ag and Sn codeposition and layer-by-layer deposition processes is presented.

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Authors and Affiliations

  1. MIET National Research University of Electronic Technology, pl. Shokina 1, Zelenograd, Moscow, 124498, Russia

    M. S. Mikhailova, V. M. Roshchin, Yu. I. Shilyaeva & I. N. Petukhov

  2. Kurnakov Institute of General and Inorganic Chemistry, Russian Academy of Sciences, Leninskii pr. 31, Moscow, 119991, Russia

    V. A. Fedorov

Authors
  1. M. S. Mikhailova
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  2. V. M. Roshchin
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  3. Yu. I. Shilyaeva
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  4. I. N. Petukhov
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  5. V. A. Fedorov
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Corresponding author

Correspondence to M. S. Mikhailova.

Additional information

Original Russian Text © M.S. Mikhailova, V.M. Roshchin, Yu.I. Shilyaeva, I.N. Petukhov, V.A. Fedorov, 2016, published in Neorganicheskie Materialy, 2016, Vol. 52, No. 12, pp. 1295–1299.

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Mikhailova, M.S., Roshchin, V.M., Shilyaeva, Y.I. et al. Electrochemical deposition of Ag–Sn alloys onto copper and titanium plates. Inorg Mater 52, 1220–1223 (2016). https://doi.org/10.1134/S0020168516110091

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  • DOI: https://doi.org/10.1134/S0020168516110091

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