Abstract
Data are presented which demonstrate that the {111} and {100} surfaces of a silicon whisker in contact with a liquid metal solvent droplet are more anisotropic than those in contact with the vapor phase. Melting of metal solvent particles on a silicon substrate is accompanied by wettability anisotropy: the (111) close-packed faces of silicon are more poorly wetted by liquid solvent droplets than are the other faces.
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Original Russian Text © V.A. Nebol’sin, A.A. Dolgachev, B.A. Spiridonov, E.V. Zotova, 2012, published in Neorganicheskie Materialy, 2012, Vol. 48, No. 8, pp. 867–872.
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Nebol’sin, V.A., Dolgachev, A.A., Spiridonov, B.A. et al. Effect of interfacial free energy anisotropy on silicon whisker growth. Inorg Mater 48, 757–762 (2012). https://doi.org/10.1134/S0020168512080109
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DOI: https://doi.org/10.1134/S0020168512080109