Abstract
The effect of process conditions on the composition and structure of anodic Cu2O films grown in sulfate-chloride electrolytes has been studied using Auger electron spectroscopy, x-ray diffraction, and atomic force microscopy. The results demonstrate that the copper and oxygen depth profiles in the anodic copper(I) oxide films (ACOFs) are similar in shape. The copper content near the surface is only slightly lower than the bulk copper content. Starting at a depth of 9 nm, the Cu content is constant at an average of 62.7 at %. The Cu2O films grown at a current density j = 3 mA/cm2 have the most perfect stoichiometry, with deviations only in the surface layer. Anodic oxidation produces unoriented polycrystalline films of complex composition. In addition to Cu2O, the films contain CuCl and trace levels of copper. Raising the anode current density influences, for the most part, the formation of (111)-oriented crystallites, changing their orientation from (111) to (220). We assume that nonmetal (oxygen or chlorine) atoms are incorporated into the cubic structure of copper without changing its symmetry but increasing its unit-cell parameter: from 0.3607 (Cu) to 0.426 (Cu2O) and to 0.541 nm (CuCl).
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Original Russian Text © L.A. Svetlichnaya, L.P. Mileshko, A.N. Korolev, 2008, published in Neorganicheskie Materialy, 2008, Vol. 44, No. 7, pp. 816–824.
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Svetlichnaya, L.A., Mileshko, L.P. & Korolev, A.N. Structure and composition of Cu2O films produced by anodizing copper foil on fiberglass laminate. Inorg Mater 44, 713–720 (2008). https://doi.org/10.1134/S0020168508070078
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DOI: https://doi.org/10.1134/S0020168508070078