Structure and electrical properties of liquid Sn, Sn0.962Ag0.038, Sn0.987Cu0.013, and Sn0.949Ag0.038Cu0.013

Inorganic Materials volume 44, pages129–133(2008)Cite this article

Abstract

We have studied the structure, electrical conductivity, and thermopower of liquid Sn, Sn0.962Ag0.038, Sn0.987Cu0.013, and Sn0.949Ag0.038Cu0.013 alloys, which are used as lead-free solders. Diffraction data have been used to develop structural models of the melts. The conductivity and thermopower data have been interpreted in terms of the proposed structural models and resonance s-d scattering.

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Affiliations

  1. Franko National University, ul. Kirila i Mefodiya 8, Lviv, 79005, Ukraine

    S. I. Mudry, V. M. Sklyarchuk, Yu. O. Plevachuk & I. I. Shtablavyi

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  1. S. I. Mudry
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  2. V. M. Sklyarchuk
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  3. Yu. O. Plevachuk
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  4. I. I. Shtablavyi
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Correspondence to S. I. Mudry.

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Original Russian Text © S.I. Mudry, V.M. Sklyarchuk, Yu.O. Plevachuk, I.I. Shtablavyi, 2008, published in Neorganicheskie Materialy, 2008, Vol. 44, No. 2, pp. 171–175.

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Mudry, S.I., Sklyarchuk, V.M., Plevachuk, Y.O. et al. Structure and electrical properties of liquid Sn, Sn0.962Ag0.038, Sn0.987Cu0.013, and Sn0.949Ag0.038Cu0.013 . Inorg Mater 44, 129–133 (2008). https://doi.org/10.1134/S0020168508020088

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Keywords

  • Structure Factor
  • Free Path
  • Radial Distribution Function
  • Eutectic Alloy
  • Silver Atom