Automation and Remote Control

, Volume 78, Issue 6, pp 1138–1143 | Cite as

Adhesion in micromechanical systems

  • A. R. Bestugin
  • I. A. Kirshina
  • A. A. Ovodenko
  • B. V. Oskolkov
  • O. M. Filonov
Sensors and Systems
  • 16 Downloads

Abstract

In this paper adhesion is considered as a factor that to a large extent defines the reliability of technological processes in microelectromechanical systems (MEMS) manufacturing using superficial technology. The physical and chemical conditions of its emergence are investigated, as well as the short-range and superficial forces causing adhesive collapse in MEMS are assessed in quantitative terms. Some suggestions on adhesion prevention at the final stages of the technological process are formulated. The existing and prospective methods used to prevent adhesion in electronic industry are also discussed.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    Mastrangelo, C.H. and Hsu, C.H, Simple Experimental Technique for the Measurement of the Work of Adhesion of Microstructures, Proc. IEEE Solid State Sensor and Actuators Workshop, Hilton Head Island, June 22–25, 1992.Google Scholar
  2. 2.
    Boyde, A. and Wood, C, Preparation of Animal-Tissues for Surfaces-Scanning Electron Microscopy, J. Microsc., 1969, vol. 90, pp. 221–249.CrossRefGoogle Scholar
  3. 3.
    Bestugin, A.R., Kirshina, I.A., Filonov, O.M., and Okin, P.A, Durability Increase Methods for the Designs of Micromechanical Sensors on Surface Acoustic Waves with Galvanic Besieged Sensitive Elements, Datch. Sist., 2014, no. 11, pp. 53–59.Google Scholar
  4. 4.
    Houston, H.R., Maboudian, R., and Howe, R.T, Ammonium Fluoride and Sticktion Treatments for Polysilicon Microstructures, Proc. 8th Conf. Solid State Sensors and Actuators, Stockholm, Sweden, June 25–29, 1995, vol. 1.Google Scholar
  5. 5.
    Alley, R.L., Mai, P., Komvopoulos, K., and Howe, R.T, Surface Roughness Modification of Interfacial Contact in Polysilicon Microstructures, Proc. 7th Conf. Solid State Sensors and Actuators, Yokogama, Japan, June 7–10, 1993, pp. 288–291.Google Scholar

Copyright information

© Pleiades Publishing, Ltd. 2017

Authors and Affiliations

  • A. R. Bestugin
    • 1
  • I. A. Kirshina
    • 1
  • A. A. Ovodenko
    • 1
  • B. V. Oskolkov
    • 1
  • O. M. Filonov
    • 1
  1. 1.Saint-Petersburg State University of Aerospace InstrumentationSt. PetersburgRussia

Personalised recommendations