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Dynamics of slip lines on the surface of polycrystalline copper

  • Defects, Dislocations, and Physics of Strength
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Abstract

Tunneling microscopy is used to study the geometry and dynamics of slip lines on the surface of cold-rolled polished copper during steady-state creep at room temperature. Dislocation sources in a 200-to 300-nm-thick surface layer are found to be initially activated under stresses. As a result, a large number of lines are formed whose lengths vary from several tens to several hundreds of nanometers. Then, dislocation sources located in deeper layers become operative, which results in the formation of slip lines as long as ≈8–9 µm. The formation, evolution, and disappearance of slip lines are caused by the motion of bands having a width of several nanometers.

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Authors and Affiliations

  1. Ioffe Physicotechnical Institute, Russian Academy of Sciences, Politekhnicheskaya ul. 26, St. Petersburg, 194021, Russia

    V. I. Vettegren & V. N. Svetlov

Authors
  1. V. I. Vettegren
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  2. V. N. Svetlov
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__________

Translated from Fizika Tverdogo Tela, Vol. 46, No. 11, 2004, pp. 1996–1999.

Original Russian Text Copyright © 2004 by Vettegren, Svetlov.

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Vettegren, V.I., Svetlov, V.N. Dynamics of slip lines on the surface of polycrystalline copper. Phys. Solid State 46, 2063–2066 (2004). https://doi.org/10.1134/1.1825550

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  • DOI: https://doi.org/10.1134/1.1825550

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