Abstract
The main problem related to the creation of microelectromechanical systems—the formation of an anisotropic profile with vertical side walls and clean flat bottom in a thick resist film—is experimentally solved by optimizing the parameters of the reactive ion beam etching process for polyimide (PI) layers with a thicknesses up to 50 μm. The optimized technique was used to form the volume parts of a microelectromotor structure by etching a PI film with an oxygen ion beam (beam current density j=0.5 mA/cm2; ion extraction energy U=800 V).
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Translated from Pis’ma v Zhurnal Tekhnichesko\(\overset{\lower0.5em\hbox{$\smash{\scriptscriptstyle\smile}$}}{l} \) Fiziki, Vol. 27, No. 3, 2001, pp. 7–13.
Original Russian Text Copyright © 2001 by Stognij, Orekhovskaya, Timoshkov, Koryakin.
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Stognij, A.I., Orekhovskaya, T.I., Timoshkov, Y.V. et al. The formation of volume elements for microelectromechanical systems in polyimide by method of reactive ion beam etching. Tech. Phys. Lett. 27, 90–92 (2001). https://doi.org/10.1134/1.1352757
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DOI: https://doi.org/10.1134/1.1352757