Abstract
In this paper two problems are formulated and solved: the problem of diffusion in a two-phase system with a moving boundary, and the problem of taking into account the finite reaction rate for formation of the new phase. A numerical solution is found by a variational method, which has a number of practical advantages.
Similar content being viewed by others
References
Fundamentals of Silicon Integrated Device Technology. Vol. 1: Oxidation, Diffusion and Epitaxy, R. M. Burger and R. P. Donovan (Eds.) [Prentice Hall, New Jersey, (1967); Mir, Moscow (1969)].
J. M. Poate, K. N. Tu, and J. M. Mayer (Eds.), Thin Films — Interdiffusion and Reactions, [New Jersey (1978); Mir, Moscow (1982)].
S. P. Murarka, Silicides for VLSI Applications [Academic Press, New York (1983); Mir, Moscow (1986)].
V. P. Maslov, V. G. Danilov, and K. A. Volosov, Mathematical Modeling of Thermal Mass-Transfer Processes [in Russian], Nauka, Moscow, 1987.
R. S. Muller and T. I. Kamins, Device Electronics for Integrated Circuits [Wiley, New York (1986); Mir, Moscow (1989)].
A. E. Gershinskii, A. V. Rzhanov, and B. I. Cherepov, Poverkhnost’, No. 2, 1 (1982).
S. V. Vasil’ev and N. N. Gerasimenko, Poverkhnost’, No. 7, 57 (1986).
B. Ya. Lobov, Theory of Crystallization in Large Volumes [in Russian], Nauka, Moscow, 1975.
A. N. Tikhonov and A. A. Samarskii, Equations of Mathematical Physics [in Russian], 4th ed. (Nauka, Moscow, 1972).
P. Gas, G. Scilla, A. Michel et al., Appl. Phys. 63, 5335 (1988).
M. Wittmer, C. Y. Ting, and K. N. Tu, Thin Solid Films 104, 215 (1983).
C. J. Wei, W. Katz, and C. Smitz, Thin Solid Films 104, 215 (1983).
M. Wittmer and T. E. Seidel, Appl. Phys. 49, 5827 (1988).
I. Ohdomari, K. N. Tu, K. Sugaro et al., Appl. Phys. Lett. 38, 1015 (1981).
P. L. Thornton, Electron. Lett. 17, 480 (1981).
Author information
Authors and Affiliations
Additional information
Zh. Tekh. Fiz. 68, 75–82 (April 1998)
Rights and permissions
About this article
Cite this article
Zon, B.A., Ledovskii, S.B. & Likholet, A.N. Modeling of certain nonuniform processes in semiconductor technology. Tech. Phys. 43, 416–422 (1998). https://doi.org/10.1134/1.1258997
Received:
Issue Date:
DOI: https://doi.org/10.1134/1.1258997