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Technical Physics Letters

, Volume 44, Issue 10, pp 919–922 | Cite as

Modeling Deformations in Multichip Packages of NAND Memory

  • M. A. BelyaevEmail author
  • V. V. Putrolaynen
  • V. A. Romanenko
Article
  • 12 Downloads

Abstract

Deformation of NAND memory multichip packages (MCPs) with various thicknesses of substrate and silicon dies have been numerically simulated. The results of calculations are consistent with experimental data and show equivalence of the deformation in single- and multichip packages with the same total thickness of silicon. Analytical relationship between the values of MCP deformation, substrate core thickness, and total thickness of silicon dies is proposed, which agrees quite well with the data of modeling and can be used for preliminary estimation of MCP deformations.

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References

  1. 1.
    R. Micheloni, S. Aritome, and L. Crippa, Proc. IEEE 105, 1634 (2017).CrossRefGoogle Scholar
  2. 2.
    H.-K. Kung and C.-L. Hsieh, J. Electron. Packag. 139, 041002 (2017).CrossRefGoogle Scholar
  3. 3.
    www.jedec.org/standards-documents/docs/spp-024a.Google Scholar
  4. 4.
    H. Ardebili and M. G. Pecht, Encapsulation Technologies for Electronic Applications (Elsevier, Oxford, 2009).Google Scholar
  5. 5.
    T. Ahsan and H. Tang, in Proceedings of the 10th Electronics Packaging Technology Conference (IEEE, Singapore, 2008), p. 1421.Google Scholar
  6. 6.
    T.-C. Chiu, H.-W. Huang, and Y.-S. Lai, Microelectron. Reliab. 51, 2263 (2011).CrossRefGoogle Scholar
  7. 7.
    B. Zhao, V. Pai, C. Brahateeswaran, G. Hu, S. Chew, and N. Chin, in Proceedings of the 7th International Conference on Electronic Packaging Technology (IEEE, Shanghai, 2006), p. 1.Google Scholar
  8. 8.
    L. B. Freund, J. A. Floro, and E. Chason, Appl. Phys. Lett. 74, 1987 (1999).ADSCrossRefGoogle Scholar

Copyright information

© Pleiades Publishing, Ltd. 2018

Authors and Affiliations

  • M. A. Belyaev
    • 1
    Email author
  • V. V. Putrolaynen
    • 1
  • V. A. Romanenko
    • 2
  1. 1.Petrozavodsk State UniversityPetrozavodskRussia
  2. 2.GS NanotechGusev, Kaliningrad oblastRussia

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