Study of adhesion of vertically aligned carbon nanotubes to a substrate by atomic-force microscopy
- 65 Downloads
The adhesion to a substrate of vertically aligned carbon nanotubes (VA CNT) produced by plasmaenhanced chemical vapor deposition has been experimentally studied by atomic-force microscopy in the current spectroscopy mode. The longitudinal deformation of VA CNT by applying an external electric field has been simulated. Based on the results, a technique of determining VA CNT adhesion to a substrate has been developed that is used to measure the adhesion strength of connecting VA CNT to a substrate. The adhesion to a substrate of VA CNT 70–120 nm in diameter varies from 0.55 to 1.19 mJ/m2, and the adhesion force from 92.5 to 226.1 nN. When applying a mechanical load, the adhesion strength of the connecting VA CNT to a substrate is 714.1 ± 138.4 MPa, and the corresponding detachment force increases from 1.93 to 10.33 μN with an increase in the VA CNT diameter. As an external electric field is applied, the adhesion strength is almost doubled and is 1.43 ± 0.29 GPa, and the corresponding detachment force is changed from 3.83 to 20.02 μN. The results can be used in the design of technological processes of formation of emission structures, VA CNT-based elements for vacuum microelectronics and micro- and nanosystem engineering, and also the methods of probe nanodiagnostics of VA CNT.
KeywordsAdhesion Strength Adhesion Force External Electric Field Detachment Force Align Carbon Nanotubes
Unable to display preview. Download preview PDF.
- 7.O. A. Ageev, O. I. Il’in, V. S. Klimin, B. G. Konoplev, and A. A. Fedotov, Khim. Fiz. Mezoskopiya 13 (2), 226 (2011).Google Scholar
- 12.Z. Xia and J. Liang, Mater. Res. Soc. Symp. Proc. 975, DD10–09 (2007).Google Scholar
- 15.O. A. Ageev, O. I. Il’in, V. S. Klimin, M. V. Rubashkina, V. A. Smirnov, Yu. Syurik, and O. G. Tsukanova, Izv. Yuzhn. Fed. Univ., Tekh. Nauki 9, 58 (2014).Google Scholar
- 16.O. A. Ageev, Al. V. Bykov, A. S. Kolomiitsev, B. G. Konoplev, M. V. Rubashkina, V. A. Smirnov, and O. G. Tsukanova, Izv. Vyssh. Uchebn. Zaved., Elektron. 20 (2), 127 (2015).Google Scholar