Physics of the Solid State

, Volume 49, Issue 1, pp 178–184 | Cite as

Kinetics of the melting-dispersion process in copper thin films

  • D. G. Gromov
  • S. A. Gavrilov
  • E. N. Redichev
  • R. M. Ammosov
Low-Dimensional Systems and Surface Physics


The kinetics of a melting-dispersion process in copper thin films is investigated at different thicknesses of the films. It is shown that the film initially melts in local regions and then the melting front propagates over the sample. Melting of copper thin films of the same thickness can occur within different time periods depending on the temperature (from almost instantaneous melting at higher temperatures to melting proceeding over the course of a few hours at lower temperatures). The dependence of the activation energy for the melting-dispersion process on the film thickness is determined and explained in terms of hydrodynamics. The mechanism of the melting-dispersion process is considered.

PACS numbers

61.46.+w 64.70.Dv 68.35.Md 68.60.Dv 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    Ya. E. Geguzin, Physics of Sintering (Nauka, Moscow, 1984) [in Russian].Google Scholar
  2. 2.
    L. J. Lewis, P. Jensen, and J.-L. Barrat, Phys. Rev. B: Condens. Matter 56, 2248 (1997).ADSGoogle Scholar
  3. 3.
    Yu. F. Komnik, Physics of Metallic Films: Size and Structural Defects (Atomizdat, Moscow, 1979) [in Russian].Google Scholar
  4. 4.
    A. I. Gusev and A. A. Rempel, Nanocrystalline Materials (Fizmatlit, Moscow, 2001; Cambridge International Science, Cambridge, 2004).Google Scholar
  5. 5.
    R. Kofman, P. Cheyssac, Y. Lereah, and A. Stella, Eur. Phys. J. D 9, 441 (1999).CrossRefADSGoogle Scholar
  6. 6.
    F. Celestini, R.J.-M. Pellenq, P. Bordarier, and B. Rousseau, Z. Phys. D: At., Mol. Clusters 37, 49 (1996).CrossRefGoogle Scholar
  7. 7.
    B. M. Patterson, K. M. Unruh, and S. I. Shah, Nanostruct. Mater. 1, 65 (1992).CrossRefGoogle Scholar
  8. 8.
    D. G. Gromov, S. A. Gavrilov, and E. N. Redichev, Zh. Fiz. Khim. 79(9), 1578 (2005) [Russ. J. Phys. Chem. 79 (9), 1394 (2005)].Google Scholar
  9. 9.
    S. A. Kukushkin and D. A. Grigor’ev, Zh. Tekh. Fiz. 65, 154 (1995) [Tech. Phys. 40, 1059 (1995)].Google Scholar
  10. 10.
    S. A. Kukushkin, D. A. Grigor’ev, D. A. Indeitsev, O. V. Potapov, and V. M. Fokin, Fiz. Khim. Stekla 27(3), 377 (2001) [Glass Phys. Chem. 27 (3), 250 (2001)].Google Scholar
  11. 11.
    Handbook of Physical Quantities, Ed. by I. S. Grigoriev and E. Z. Meilikhov (Energoatomizdat, Moscow, 1991; CRC, Boca Raton, FL, 1997).Google Scholar
  12. 12.
    A. E. Dolbak, R. A. Zhachuk, and B. Z. Olshanetsky, Fiz. Tekh. Poluprovodn. (St. Petersburg) 35(9), 1063 (2001) [Semiconductors 35 (9), 1018 (2001)].Google Scholar
  13. 13.
    Ya. E. Geguzin, in Surface Diffusion and Spreading, Ed. by Ya. E. Geguzin (Nauka, Moscow, 1969) [in Russian].Google Scholar
  14. 14.
    Thin Films: Interdiffusion and Reaction, Ed. by J. Poate, K. Tu, and J. Mayer (Wiley, New York, 1978; Mir, Moscow, 1982).Google Scholar
  15. 15.
    V. F. Kiselev, S. N. Kozlov, and A. V. Zoteev, Principles of the Physics of Solid State Surface (Moscow State University, Moscow, 1999) [in Russian].Google Scholar
  16. 16.
    L. D. Landau and E. M. Lifshitz, Course of Theoretical Physics, Vol. 6: Fluid Mechanics (Butterworth-Heinemann, Oxford, 1987; Fizmatlit, Moscow, 2003).Google Scholar

Copyright information

© Pleiades Publishing, Ltd. 2007

Authors and Affiliations

  • D. G. Gromov
    • 1
  • S. A. Gavrilov
    • 1
  • E. N. Redichev
    • 1
  • R. M. Ammosov
    • 2
  1. 1.Moscow State Institute of Electronic EngineeringZelenograd, Moscow oblastRussia
  2. 2.Lukin State Research Institute for Problems in PhysicsZelenograd, Moscow oblastRussia

Personalised recommendations