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Physics of the Solid State

, Volume 49, Issue 1, pp 178–184 | Cite as

Kinetics of the melting-dispersion process in copper thin films

  • D. G. Gromov
  • S. A. Gavrilov
  • E. N. Redichev
  • R. M. Ammosov
Low-Dimensional Systems and Surface Physics

Abstract

The kinetics of a melting-dispersion process in copper thin films is investigated at different thicknesses of the films. It is shown that the film initially melts in local regions and then the melting front propagates over the sample. Melting of copper thin films of the same thickness can occur within different time periods depending on the temperature (from almost instantaneous melting at higher temperatures to melting proceeding over the course of a few hours at lower temperatures). The dependence of the activation energy for the melting-dispersion process on the film thickness is determined and explained in terms of hydrodynamics. The mechanism of the melting-dispersion process is considered.

PACS numbers

61.46.+w 64.70.Dv 68.35.Md 68.60.Dv 

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Copyright information

© Pleiades Publishing, Ltd. 2007

Authors and Affiliations

  • D. G. Gromov
    • 1
  • S. A. Gavrilov
    • 1
  • E. N. Redichev
    • 1
  • R. M. Ammosov
    • 2
  1. 1.Moscow State Institute of Electronic EngineeringZelenograd, Moscow oblastRussia
  2. 2.Lukin State Research Institute for Problems in PhysicsZelenograd, Moscow oblastRussia

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