, Volume 49, Issue 6, pp 724–728 | Cite as

Recombination activity of interfaces in multicrystalline silicon

  • S. M. Peshcherova
  • E. B. Yakimov
  • A. I. Nepomnyashchikh
  • L. A. Pavlova
  • O. V. Feklisova
Proceedings of the Conference “Silicon-2014”, Irkutsk, July 7–12, 2014 Surfaces, Interfaces, and Thin Films


The electrical activity of grain boundaries in multicrystalline silicon grown from metallurgical silicon by the Bridgman method is investigated by the method of electron-beam induced current. The main tendencies of atypical manifestation of the local electrical activity of Σ3{111} and Σ9{110} special boundaries are revealed. The structural features of the grain boundaries after selective etching and the impurity-distribution characteristics in multicrystalline silicon are determined by the methods of electron backscattering diffraction and electron-probe microanalysis.


Special Boundary Bridgman Method Recombination Activity Multicrystalline Silicon Backscatter Electron Mode 
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Copyright information

© Pleiades Publishing, Ltd. 2015

Authors and Affiliations

  • S. M. Peshcherova
    • 1
  • E. B. Yakimov
    • 2
  • A. I. Nepomnyashchikh
    • 1
  • L. A. Pavlova
    • 1
  • O. V. Feklisova
    • 2
  1. 1.Vinogradov Institute of Geochemistry, Siberian BranchRussian Academy of SciencesIrkutskRussia
  2. 2.Institute of Microelectronics Technology and High-Purity MaterialsRussian Academy of SciencesChernogolovka, Moscow oblastRussia

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