Russian Microelectronics

, Volume 47, Issue 7, pp 460–464 | Cite as

Structural Strength and Temperature Condition of Multi-Chip Modules

  • A. I. Pogalov
  • G. A. Blinov
  • E. Yu. ChugunovEmail author


The general principles of designing three-dimensional multichip modules are presented. The multichip modules are simulated and the effect of the design variables on the strength and temperature condition of the products is studied. The values of thermomechanical stresses, heat resistance, and overheating temperatures of the materials are determined, and the heat removal efficiency in various structural variations of three-dimensional modules is also found. Methods for providing an intensive heat transfer in the structures of the modules and increasing the strength consistency of the products are developed. Recommendations on the design of multichip modules are given.


multichip module structural strength of products temperature condition of three-dimensional modules strain-stress state of materials finite-element method 



  1. 1.
    Gus’kov, G.Ya., Blinov, G.A., and Gazarov, A.A., Montazh mikroelektronnoi apparatury (Mounting of Microelectronic Devices), Moscow: Radio Svyaz’, 1986.Google Scholar
  2. 2.
    Grushevskii, A.M., Sborka i montazh mnogokristal’nykh mikromodulei: uch. posobie (Assembly and Mounting of Multi-Chip Micromodules, The School-Book), Koledov, L.A., Ed., Moscow: MIET, 2003.Google Scholar
  3. 3.
    Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Thermophysical calculations and design engineering of multilayered structures of microelectronic devices, Konstrukts. Kompoz. Mater., 2012, no. 4, pp. 3–7.Google Scholar
  4. 4.
    Kuznetsov, O.A., Pogalov, A.I., and Sergeev, V.S., Prochnost’ elementov mikroelektronnoi apparatury (Strength of Microelectronic Devices Elements), Moscow: Radio Svyaz’, 1990.Google Scholar
  5. 5.
    Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Thermal burdening of functional three-dimensional multichip micromodules, Oboron. Kompleks-Nauch.-Tekh. Progressu Ross., 2013, no. 1, pp. 77–82.Google Scholar
  6. 6.
    Feodos’ev, V.I., Soprotivlenie materialov: ucheb. dlya vuzov (Strength of Materials, The School-Book), Moscow: MGTU im. N.E. Baumana, 2000; Moscow: Mir, 1968.Google Scholar
  7. 7.
    Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Modeling of thermal strength of multichip micromodules, Izv. Vyssh. Uchebn. Zaved., Elektron., 2010, no. 5, pp. 73–75.Google Scholar
  8. 8.
    Pogalov, A.I., Blinov, G.A., and Chugunov, E.Yu., Stress-strain state and thermal conditions of multilayer glue joints of multicrystalline micromodules, Konstrukts. Kompoz. Mater., 2013, no. 2, pp. 18–22.Google Scholar

Copyright information

© Pleiades Publishing, Ltd. 2018

Authors and Affiliations

  • A. I. Pogalov
    • 1
  • G. A. Blinov
    • 1
  • E. Yu. Chugunov
    • 1
    Email author
  1. 1.National Research University of Electronic TechnologyMoscowRussia

Personalised recommendations