Copper-Containing Compositions Based on Alicyclic Polyimide for Microelectronic Applications
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The creation of polymer compositions with high electrophysical properties compatible with various types of fillers, including metal-containing compounds, is of vital importance for microelectronics. By polycondensation, new copper-containing polymer compositions based on alicyclic polyimide and its copolymers with aromatic polyheterocycles are obtained. The thermal, chemical, and physicomechanical properties and electrical conductivity of the new film composite materials are investigated. The conditions for obtaining copper-containing polymer compositions based on alicyclic polyimide and its copolymers with aromatic polyheterocycles are optimized. The samples are prepared in two ways: via a one-stage polycondensation reaction in the presence of catalytic amounts of inorganic compounds and via mechanically mixing the polymer components with the copper salts. A new film composite material with high physicomechanical and temperature characteristics and increased resistance to aggressive reagents is obtained. The developed metal-containing polymer compositions can be recommended for use in microelectronics for manufacturing integrated circuits as well as for obtaining elastic heat-conducting insulators operating in the temperature range from –180 to +400°C.
Keywords:copper-containing polyimide compositions for microelectronics alicyclic and aromatic structures
The work was carried out under the financial support of the Ministry of Education and Science of the Republic of Kazakhstan (“Theoretical foundations for the creation of new polymer composition materials with specific properties” grant for 2015–2017) and under the contract for joint research between MIET (Russia) and the Bekturov Institute of Chemical Sciences (the Republic of Kazakhstan).
- 1.Umbetova, M., Kravtsova, V., Korobova, N., and Iskakov, R., Synthesis peculiarities of electrically conductive materials on metallized polyimide as elements of flexible solar cells, Izv. Vyssh. Uchebn. Zaved., Elektron., 2016, vol. 21, no. 3, pp. 201–207.Google Scholar
- 2.Kravtsova, V., Umerzakova, M., Korobova N., et al., Heat-resistant polymeric materials based on polyimides for microsystem electronic modules, in Tr. Mezhdunar. foruma “Mikroelektronika–2016” (Proceedings of the International Forum Microelectronics-2016, Alushta, Krym, 2016, pp. 461–465.Google Scholar
- 4.Zhubanov, B.A., Umerzakova, M.B., Kravtsova, V.D., et al., Preparation of composite materials based on alicyclic polyimide with various additives, Khim. Zh. Kazakhstana, 2015, no. 4, pp. 101–109.Google Scholar
- 5.Kravtsova, V.D., Umerzakova, M., Iskakov, R., and Korobova, N., Electrical properties of fluoro-containing alicyclic polyimides, J. Chem. Chem. Eng., 2015, vol. 9, no. 1, pp. 31–37.Google Scholar
- 6.Metz, S., Jiguet, S., Bertsch, A., and Renaud, Ph., Polyimide and SU-8 microfluidic devices manufactured by heat-depolymerizable sacrificial material technique, Lab. Chip, 2004, no. 4, pp. 114–120.Google Scholar
- 7.Davletbaev, R.S., Naumov, A.V., and Davletbaev, I.M., Metal-complex modification of compositions based on phenol-formaldehyde resin and araimide paper, Vestn. Kazan. Tekhnol. Univ., 2011, no. 14, pp. 174–180.Google Scholar
- 8.Kablov, V.F., Petroyuk, I.P., and Kaleev, V.O., Influence of high-disperse particles of copper on electrocarrying-OuT properties of rubbers based on ethylene-propylene resin, Sovrem. Naukoemk. Tekhnol., 2013, no. 5, pp. 55–57.Google Scholar