Modeling of the high aspect groove etching in Si in a Cl2/Ar mixture plasma
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The model and the results of the modeling of etching deep grooves in Si in Сl2/Ar plasma as a function of the energy of Cl+ and Ar+ incident ions (30–250 eV), taking into consideration the redeposition of the reaction products, which are removed from the groove bottom, are represented. The groove profiles with an aspect ratio (depth-to-width groove ratio) below 5 and Si atom yield coefficients per ion as a function of the incident ion energy were in agreement with the reference data. The profile evolution of the deep grooves with an aspect ratio (AR) of up to 10 at different energies of the incident ions is shown. The influence of the redeposition coefficient of the scattered particles and the shape of the mask on the groove profile is considered. The reasons for distorting the profile of the high-aspect grooves during their etching in the Сl2/Ar plasma are discussed.
KeywordsRUSSIAN Microelectronics SiCl Yield Coefficient Deep Groof Adhesion Coefficient
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- 8.Mahorowala, A.P. and Sawin, H.H., Etching of polysilicon in inductively coupled Cl2 and HBr discharges. II. Simulation of profile evolution using cellular representation of feature composition and Monte Carlo computation of flux and surface kinetics, J. Vac. Technol. B, 2002, vol. 20, no. 3, pp. 1064–1076.CrossRefGoogle Scholar
- 16.Eckstein, W., Computer Simulation of Ion-Solid Interactions, Berlin: Springer, 1991.Google Scholar